The 74ALVC16836A is a 20-bit universal bus driver. Data flow is controlled by active low output enable (OE), active low latch enable (LE) and clock inputs (CP).
When LE is LOW, the A to Y data flow is transparent. When LE is HIGH and CP is held at LOW or HIGH, the data is latched; on the LOW to HIGH transient of CP the A-data is stored in the latch/flip-flop.
When OE is LOW the outputs are active. When OE is HIGH, the outputs go to the high impedance OFF-state. Operation of the OE input does not affect the state of the latch/flip-flop.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Name/Description | Modified Date |
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20-bit registered driver with inverted register enable (3-state) (REV 1.0) PDF (122.0 kB) 74ALVC16836A [English] | 14 Mar 2014 |
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Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
A metastability primer (REV 1.0) PDF (40.0 kB) AN219 [English] | 13 Mar 2013 |
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English] | 13 Mar 2013 |
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English] | 13 Mar 2013 |
Interfacing 3 Volt and 5 Volt Applications (REV 1.0) PDF (63.0 kB) AN240 [English] | 15 Sep 1995 |
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Low voltage CMOS family - LVC (REV 1.0) PDF (2.6 MB) 75017668 [English] | 10 Jul 2015 |
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English] | 16 Feb 2015 |
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English] | 20 May 2014 |
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ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English] | 19 Nov 2015 |
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English] | 08 Jan 2015 |
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plastic thin shrink small outline package; 56 leads; body width 6.1 mm (REV 1.0) PDF (506.0 kB) SOT364-1 [English] | 08 Feb 2016 |
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TSSOP56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (248.0 kB) SOT364-1_118 [English] | 15 Apr 2013 |
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Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
Product | Status |
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74ALVC16836ADGG | Active |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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74ALVC16836ADGG | SOT364-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74ALVC16836ADGG,11 (9352 673 85118) | 74ALVC16836A | 74ALVC16836ADGG | week 40, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||
Bulk Pack | Active | 74ALVC16836ADGG:11 (9352 673 85112) | 74ALVC16836A | 74ALVC16836ADGG | week 40, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |