74AUP1G373: Low-power D-type transparent latch; 3-state (Based on PIP 74AUP1G373)

The 74AUP1G373 provides the single D-type transparent latch with 3-state output. While the latch-enable (LE) input is high, the Q output follows the data (D) input. When pin LE is LOW, the latch stores the information that was present at the D-input one set-up time preceding the HIGH-to-LOW transition of pin LE. When pin OE is LOW, the contents of the latch is available at the (Q) output. When pin OE is HIGH, the output goes to the high-impedance OFF-state. Operation of input pin OE does not affect the state of the latch.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

74AUP1G373: Product Block Diagram
Outline 3d SOT886
Data Sheets (1)
Name/DescriptionModified Date
Low-power D-type transparent latch; 3-state (REV 6.0) PDF (226.0 kB) 74AUP1G373 [English]04 Jul 2012
Application Notes (5)
Name/DescriptionModified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
A metastability primer (REV 1.0) PDF (40.0 kB) AN219 [English]13 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN11052 [English]06 May 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]30 Oct 2002
Brochures (3)
Name/DescriptionModified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
Selector Guides (2)
Name/DescriptionModified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
Package Information (4)
Name/DescriptionModified Date
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]08 Feb 2016
Packing (5)
Name/DescriptionModified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]04 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
Supporting Information (6)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]03 Jun 2013
IBIS Model
Ordering Information
ProductStatus
74AUP1G373GSActive
74AUP1G373GMActive
74AUP1G373GWActive
74AUP1G373GNActive
74AUP1G373GFActive
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
74AUP1G373GFSOT891Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74AUP1G373GF,132 (9352 813 32132)aW74AUP1G373GFAlways Pb-free0.03.293.04E811
74AUP1G373GNReel 7" Q1/T1, Q3/T4Active74AUP1G373GN,132 (9352 917 38132)aWAlways Pb-free11
74AUP1G373GWSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74AUP1G373GW,125 (9352 806 21125)aW74AUP1G373GWAlways Pb-free0.03.293.04E811
74AUP1G373GMSOT886Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74AUP1G373GM,132 (9352 806 22132)aW74AUP1G373GMAlways Pb-free0.03.293.04E811
Reel 7" Q1/T1Active74AUP1G373GM,115 (9352 806 22115)aW74AUP1G373GMAlways Pb-free0.03.293.04E811
74AUP1G373GSSOT1202Reel 7" Q1/T1, Q3/T4Active74AUP1G373GS,132 (9352 928 63132)aW74AUP1G373GSAlways Pb-free11
Low-power D-type transparent latch; 3-state 74AUP1G373GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
A metastability primer 74AHC573PW
Pin FMEA for AUP family 74AUP1T34GW-Q100
MicroPak soldering information NTS0102_Q100
PicoGate Logic footprints NX3L4684
電圧レベルシフタ 74AVC16245DGG-Q100
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT363 Topmark BSS84AKS
MAR_SOT886 Topmark prtr5v0u2f
MAR_SOT891 Topmark prtr5v0u2k
aup1g373 IBIS model 74AUP1G373GW
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
Reversed product orientation 12NC ending 132 NTS0101
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