74AUP1G374GW-Q100: Low-power D-type flip-flop; positive-edge trigger; 3-state

The 74AUP1G374-Q100 provides the single D-type flip-flop with 3-state output. The flip-flop stores the state of data input (D) that meets the set-up and hold times requirements on the LOW-to-HIGH CP transition. When pin OE is LOW, the contents of the flip-flop is available at the (Q) output. When pin OE is HIGH, the output goes to the high-impedance OFF-state. Operation of input pin OE does not affect the state of the flip-flop.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

74AUP1G374GW-Q100: Product Block Diagram
SOT363
Data Sheets (1)
Name/DescriptionModified Date
Low-power D-type flip-flop; positive-edge trigger; 3-state (REV 1.0) PDF (126.0 kB) 74AUP1G374_Q10019 Feb 2013
Application Notes (2)
Name/DescriptionModified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN1015613 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN1105206 May 2011
Brochures (3)
Name/DescriptionModified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 7501745813 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 7501751120 May 2014
Selector Guides (2)
Name/DescriptionModified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 7501728508 Jan 2015
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_108 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_12520 Nov 2012
Supporting Information (3)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT36303 Jun 2013
Ordering Information
ProductStatusVCC (V)FamilyDescriptionLogic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pinsPackage version
74AUP1G374GW-Q100Active1.1 - 3.6AUPsingle D-type flip-flopCMOS+/- 1.97.9400ultra low-40~12526438.6153TSSOP66SOT363
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
74AUP1G374GW-Q100SOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74AUP1G374GW-Q100H (9353 002 12125)aX74AUP1G374GW-Q100Always Pb-free11