74AUP2G17: Low-power dual Schmitt trigger (Based on PIP 74AUP2G17)

The 74AUP2G17 provides two Schmitt trigger buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.

Outline 3d SOT886
Data Sheets (1)
Name/DescriptionModified Date
Low-power dual Schmitt trigger (REV 6.0) PDF (208.0 kB) 74AUP2G17 [English]04 Dec 2012
Application Notes (4)
Name/DescriptionModified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN11052 [English]06 May 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]30 Oct 2002
Brochures (3)
Name/DescriptionModified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
Selector Guides (2)
Name/DescriptionModified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
Package Information (5)
Name/DescriptionModified Date
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]08 Feb 2016
Packing (6)
Name/DescriptionModified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]04 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
Supporting Information (7)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]03 Jun 2013
IBIS Model
Ordering Information
ProductStatus
74AUP2G17GWActive
74AUP2G17GSActive
74AUP2G17GFActive
74AUP2G17GNActive
74AUP2G17GMActive
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
74AUP2G17GNSOT1115Reel 7" Q1/T1, Q3/T4Active74AUP2G17GN,132 (9352 917 63132)pV74AUP2G17GNAlways Pb-free11
74AUP2G17GFSOT891Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74AUP2G17GF,132 (9352 813 25132)pV74AUP2G17GFAlways Pb-free0.03.293.04E811
74AUP2G17GSSOT1202Reel 7" Q1/T1, Q3/T4Active74AUP2G17GS,132 (9352 928 88132)pV74AUP2G17GSAlways Pb-free11
74AUP2G17GWSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74AUP2G17GW,125 (9352 799 91125)pV74AUP2G17GWAlways Pb-free0.03.293.04E811
74AUP2G17GMSOT886Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74AUP2G17GM,132 (9352 799 92132)pV74AUP2G17GMAlways Pb-free0.03.293.04E811
Reel 7" Q1/T1Active74AUP2G17GM,115 (9352 799 92115)pV74AUP2G17GMAlways Pb-free0.03.293.04E811
Low-power dual Schmitt trigger 74AUP2G17GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Pin FMEA for AUP family 74AUP1T34GW-Q100
MicroPak soldering information NTS0102_Q100
PicoGate Logic footprints NX3L4684
電圧レベルシフタ 74AVC16245DGG-Q100
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT1115 Topmark 74AUP1G332
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT363 Topmark BSS84AKS
MAR_SOT886 Topmark prtr5v0u2f
MAR_SOT891 Topmark prtr5v0u2k
aup2g17 IBIS model 74AUP2G17GW
SOT1115 74AUP1G332
Reel 7" Q1/T1, Q3/T4 74AUP1G332
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
Reversed product orientation 12NC ending 132 NTS0101
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
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