74AUP2G34: Low-power dual buffer (Based on PIP 74AUP2G34)

The 74AUP2G34 provides two low-power, low-voltage buffers.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

74AUP2G34: Product Block Diagram

Outline 3d SOT886

Data Sheets (1)

Name/Description	Modified Date
Low-power dual buffer (REV 6.0) PDF (203.0 kB) 74AUP2G34 [English]	17 Sep 2015

Application Notes (4)

Name/Description	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN11052 [English]	06 May 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]	30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]	30 Oct 2002

Brochures (3)

Name/Description	Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]	16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]	13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]	20 May 2014

Selector Guides (2)

Name/Description	Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]	19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]	08 Jan 2015

Package Information (6)

Name/Description	Modified Date
plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.35 mm (REV 1.1) PDF (217.0 kB) SOT1255 [English]	22 Apr 2016
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]	08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]	08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]	08 Feb 2016

Packing (7)

Name/Description	Modified Date
X2SON6; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 3.0) PDF (202.0 kB) SOT1255_147 [English]	20 Oct 2016
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]	26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]	23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]	04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]	04 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]	28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]	20 Nov 2012

Supporting Information (7)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]	03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]	03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]	03 Jun 2013

IBIS Model

aup2g34 IBIS model (REV 1.0) ibs AUP2G34 9/7/2015

Ordering Information

Product	Status
74AUP2G34GW	Active
74AUP2G34GN	Active
74AUP2G34GF	Active
74AUP2G34GS	Active
74AUP2G34GM	Active
74AUP2G34GX	Active

Package Information

Product ID	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
74AUP2G34GM	SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74AUP2G34GM,132 (9352 799 95132)	aA	74AUP2G34GM	Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP2G34GM	SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	74AUP2G34GM,115 (9352 799 95115)	aA	74AUP2G34GM	Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP2G34GN	SOT1115		Reel 7" Q1/T1, Q3/T4	Active	74AUP2G34GN,132 (9352 917 64132)	aA	74AUP2G34GN	Always Pb-free				1	1
74AUP2G34GS	SOT1202		Reel 7" Q1/T1, Q3/T4	Active	74AUP2G34GS,132 (9352 928 89132)	aA	74AUP2G34GS	Always Pb-free				1	1
74AUP2G34GX	SOT1255		Reel 7" Q2/T3	Active	74AUP2G34GXZ (9353 070 72147)	Standard Marking	74AUP2G34GX	Always Pb-free				1	1
74AUP2G34GF	SOT891	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74AUP2G34GF,132 (9352 812 96132)	aA	74AUP2G34GF	Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP2G34GW	SOT363	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AUP2G34GW,125 (9352 799 93125)	aA		Always Pb-free	0.0	3.29	3.04E8	1	1