74AVC1T1022DP: 1-to-4 fan-out buffer

The 74AVC1T1022 is a translating 1-to-4 fan-out buffer suitable for use in clock distribution. It has dual supplies (VCC(A) and VCC(B)) for voltage translation. It also has a data input (A), four data outputs (1Yn and 2Yn) and an output enable input (OE). VCC(A) and VCC(B) can be independently supplied at any voltage between 0.8 V and 3.6 V. It makes the device suitable for low voltage translation between any of the following voltages: 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V. The levels of A, OE and 1Yn are referenced to VCC(A), outputs 2Yn are referenced to VCC(B). This supply configuration ensures that two of the fanned out signals can be used in level shifting. A HIGH on OE causes all outputs to be pulled LOW via pull-down resistors, a LOW on OE disconnects the pull-down resistors and enables all outputs.

Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time.

The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down.

sot552-1_3d
Data Sheets (1)
Name/DescriptionModified Date
1-to-4 fan-out buffer (REV 1.0) PDF (243.0 kB) 74AVC1T1022 [English]07 Dec 2015
Package Information (1)
Name/DescriptionModified Date
plastic thin shri small outline package; 10 leads; body width 3 mm (REV 1.1) PDF (256.0 kB) SOT552-1 [English]07 Jun 2016
Packing (1)
Name/DescriptionModified Date
TSSOP10; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (269.0 kB) SOT552-1_118 [English]16 Apr 2013
Supporting Information (3)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
IBIS Model
Ordering Information
ProductStatusVCC(A) (V)FamilyVCC(B) (V)DescriptionLogic switching levelsOutput drive capability (mA)tpd (ns)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pinsPackage version
74AVC1T1022DPActiveTSSOP1010SOT552-1
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
74AVC1T1022DPSOT552-1Reflow_Soldering_Profile SSOP-TSSOP-VSO-WAVE
Reflow_Soldering_Profile SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1Active74AVC1T1022DPJ (9353 058 31118)Standard Marking74AVC1T1022DPAlways Pb-free11
1-to-4 fan-out buffer 74AVC1T1022GU
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
74AVC1T1022 IBIS model 74AVC1T1022GU
plastic thin shri small outline package; 10 leads; body width 3 mm 74AXP2T08DP-Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
TSSOP10; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... 74AXP2T08DP-Q100
PCA9633