74AXP1G57: Low-power configurable multiple function gate

The 74AXP1G57 is a configurable multiple function gate with Schmitt‑trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected directly to VCC or GND.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Outline 3d SOT886

Data Sheets (1)

Name/Description	Modified Date
Low-power configurable multiple function gate (REV 3.0) PDF (228.0 kB) 74AXP1G57 [English]	16 Sep 2015

Brochures (2)

Name/Description	Modified Date
NXP® 74AXP1G57 Demoboard brochure (REV 1.0) PDF (972.0 kB) 75017471 [English]	24 Oct 2013
AXP - the logic family for portable applications: Advanced, extremely-low voltage and power CMOS logic (REV 1.0) PDF (1.1 MB) 75017461 [English]	27 Jun 2013

Selector Guides (2)

Name/Description	Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]	19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]	08 Jan 2015

Package Information (4)

Name/Description	Modified Date
plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.35 mm (REV 1.1) PDF (217.0 kB) SOT1255 [English]	22 Apr 2016
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]	08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016

Packing (1)

Name/Description	Modified Date
X2SON6; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 3.0) PDF (202.0 kB) SOT1255_147 [English]	20 Oct 2016

Supporting Information (4)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]	03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013

IBIS Model

74AXP1G57 IBIS model (REV 1.0) ibs AXP1G57 9/9/2015

Ordering Information

Product	Status
74AXP1G57GN	Active
74AXP1G57GS	Active
74AXP1G57GM	Active
74AXP1G57GX	Active

Package Information

Product ID	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	LeadFree Conversion Date	MSL	MSL LF
74AXP1G57GN	SOT1115		Reel 7" Q3/T4, Reverse	Active	74AXP1G57GNH (9353 015 97125)	RC	74AXP1G57GN	Always Pb-free	1	1
74AXP1G57GS	SOT1202		Reel 7" Q3/T4, Reverse	Active	74AXP1G57GSH (9353 015 98125)	RC	74AXP1G57GS	Always Pb-free	1	1
74AXP1G57GX	SOT1255		Reel 7" Q2/T3	Active	74AXP1G57GXZ (9353 070 74147)	Standard Marking	74AXP1G57GX	Always Pb-free	1	1
74AXP1G57GM	SOT886	Reflow_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AXP1G57GMH (9353 015 96125)	RC	74AXP1G57GM	Always Pb-free	1	1