74LVC11DB: Triple 3-input AND gate _ BDTIC a Leading Distributor in China

74LVC11DB: Triple 3-input AND gate

The 74LVC11 provides three 3-input AND functions.

74LVC11DB: Product Block Diagram

Outline 3d SOT337-1

Data Sheets (1)

Name/Description	Modified Date
Triple 3-input AND gate (REV 6.0) PDF (113.0 kB) 74LVC11 [English]	15 Dec 2011

Application Notes (5)

Name/Description	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]	13 Mar 2013
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English]	04 Feb 2011
Power considerations when using CMOS and BiCMOS logic devices (REV 1.0) PDF (100.0 kB) AN263 [English]	05 Feb 2002
Interfacing 3 Volt and 5 Volt Applications (REV 1.0) PDF (63.0 kB) AN240 [English]	15 Sep 1995

Brochures (1)

Name/Description	Modified Date
Low voltage CMOS family - LVC (REV 1.0) PDF (2.6 MB) 75017668 [English]	10 Jul 2015

Selector Guides (2)

Name/Description	Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]	19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]	08 Jan 2015

Package Information (1)

Name/Description	Modified Date
plastic shrink small outline package; 14 leads; body width 5.3 mm (REV 1.0) PDF (295.0 kB) SOT337-1 [English]	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Standard product orientation 12NC ending 118 (REV 1.0) PDF (86.0 kB) SOT337-1_118 [English]	04 Apr 2013

Supporting Information (2)

Name/Description	Modified Date
Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English]	08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]	08 Oct 2009

IBIS Model

lvc11 IBIS model (REV 1.0) ibs LVC11 4/7/2013

SPICE model

lvc Spice model (REV 1.0) ZIP LVC 5/7/2013

Ordering Information

Product	Status	Family	Function	V_CC (V)	Type	Logic switching levels	Description	Package version	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	No of bits	Power dissipation considerations	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name	No of pins
74LVC11DB	Active	LVC	AND gates	1.2 - 3.6	AND gates	TTL	triple 3-input AND gate	SOT337-1	+/- 24	3.7	150	3	low	-40~125	156	40.0		SSOP14	14

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
74LVC11DB		SOT337-1	SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1	Active	74LVC11DB,118 (9352 059 20118)	LVC11	74LVC11DB		week 12, 2005	123.8	3.87	2.58E8	1	1
74LVC11DB		SOT337-1		Bulk Pack	Active	74LVC11DB,112 (9352 059 20112)	LVC11	74LVC11DB		week 12, 2005	123.8	3.87	2.58E8	1	1

Triple 3-input AND gate 74LVC11PW

Sorting through the low voltage logic maze 74LVC_H_245A_Q100

Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100

Pin FMEA for LVC family 74LVC1G123_Q100

Power considerations when using CMOS and BiCMOS logic devices 74AHCT244PW

Interfacing 3 Volt and 5 Volt Applications 74LVC377PW

Low voltage CMOS family - LVC 74LVC_H_245A_Q100

ロジック製品セレクションガイド... 74LVC_H_245A_Q100

Logic selection guide 2016 74LVC_H_245A_Q100

lvc11 IBIS model 74LVC11PW

lvc Spice model 74LVC3G17GT

plastic shrink small outline package; 14 leads; body width 5.3 mm 74LVC32A_Q100

Footprint for reflow soldering 74HC_T_595_Q100

SSOP-TSSOP-VSO-WAVE LPC1114FDH28

Standard product orientation 12NC ending 118 74LVC32A_Q100

74LVC11

74LV164

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