The 74LVC1G08 provides one 2-input AND function.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications.
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall time.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Name/Description | Modified Date |
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Single 2-input AND gate (REV 10.0) PDF (349.0 kB) 74LVC1G08 [English] | 29 Jun 2012 |
Name/Description | Modified Date |
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Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English] | 30 Oct 2002 |
Name/Description | Modified Date |
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extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English] | 08 Feb 2016 |
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English] | 08 Feb 2016 |
plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals (REV 1.0) PDF (199.0 kB) SOT1226 [English] | 08 Feb 2016 |
plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English] | 08 Feb 2016 |
plastic surface-mounted package; 5 leads (REV 1.0) PDF (243.0 kB) SOT753 [English] | 08 Feb 2016 |
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English] | 03 Jun 2013 |
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English] | 03 Jun 2013 |
MAR_SOT1226 Topmark (REV 1.0) PDF (35.0 kB) MAR_SOT1226 [English] | 03 Jun 2013 |
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English] | 03 Jun 2013 |
MAR_SOT753 Topmark (REV 1.0) PDF (89.0 kB) MAR_SOT753 [English] | 03 Jun 2013 |
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English] | 03 Jun 2013 |
Product | Status |
---|---|
74LVC1G08GW | Active |
74LVC1G08GM | Active |
74LVC1G08GN | Active |
74LVC1G08GF | Active |
74LVC1G08GS | Active |
74LVC1G08GV | Active |
74LVC1G08GX | Active |