74LVC1G57: Low-power configurable multiple function gate (Based on PIP 74LVC1G57)

The 74LVC1G57 provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected to VCC or GND.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

All inputs (A, B and C) are Schmitt trigger inputs. They are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

74LVC1G57: Product Block Diagram

SOT457

Data Sheets (1)

Name/Description	Modified Date
Low-power configurable multiple function gate (REV 7.0) PDF (225.0 kB) 74LVC1G57 [English]	10 Sep 2014

Application Notes (5)

Name/Description	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]	13 Mar 2013
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English]	04 Feb 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]	30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]	30 Oct 2002

Brochures (1)

Name/Description	Modified Date
Low voltage CMOS family - LVC (REV 1.0) PDF (2.6 MB) 75017668 [English]	10 Jul 2015

Package Information (6)

Name/Description	Modified Date
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]	08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]	08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]	08 Feb 2016
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]	08 Feb 2016

Packing (7)

Name/Description	Modified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]	26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]	23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]	04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]	04 Apr 2013
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]	30 Nov 2012
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]	28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]	20 Nov 2012

Supporting Information (8)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]	03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]	03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]	03 Jun 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]	03 Jun 2013

IBIS Model

74LVC1G57 IBIS model (REV 1.0) ibs LVC1G57 10/21/2014

Ordering Information

Product	Status
74LVC1G57GV	Active
74LVC1G57GW	Active
74LVC1G57GM	Active
74LVC1G57GN	Active
74LVC1G57GF	Active
74LVC1G57GS	Active

Package Information

Product ID	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
74LVC1G57GS	SOT1202		Reel 7" Q1/T1, Q3/T4	Active	74LVC1G57GS,132 (9352 929 16132)	YC	74LVC1G57GS	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GW	SOT363	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74LVC1G57GW,125 (9352 760 71125)	YC	74LVC1G57GW	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GN	SOT1115		Reel 7" Q1/T1, Q3/T4	Active	74LVC1G57GN,132 (9352 917 88132)	YC	74LVC1G57GN	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GV	SOT457	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74LVC1G57GV,125 (9352 760 73125)	V57	74LVC1G57GV	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GM	SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74LVC1G57GM,132 (9352 772 11132)	YC	74LVC1G57GM	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GM	SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	74LVC1G57GM,115 (9352 772 11115)	YC	74LVC1G57GM	Always Pb-free	123.8	3.87	2.58E8	1	1
74LVC1G57GF	SOT891	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74LVC1G57GF,132 (9352 824 23132)	YC	74LVC1G57GF	Always Pb-free	123.8	3.87	2.58E8	1	1