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74LVCH32373AEC:32位D型透明锁存器,具有5 V容压输入/输出;3态

74LVCH32373A是32位D型穿透锁存器,具有适用于每个锁存器的单独D型输入和适合总线应用的3态输出。每个八位部分都提供一个锁存使能(nLE)输入和一个输出使能输入(nOE)。输入可通过3.3 V或5 V器件进行驱动。

该器件由八个带3态真正输出的D型穿透锁存器的4部分组成。输入nLE为高电平时,nDn输入处的数据会输入锁存器。在这种情况下,锁存器是穿透的,即每当与锁存输出对应的D输入发生变化时,锁存输出都会随之变化。

输入nLE为低电平时,锁存器存储nLE从高电平跃迁至低电平前的一个设置时间在D输入处出现的信息。输入nOE为低电平时,八个锁存器的内容可在输出上获取。输入nOE为高电平时,输出转为高阻抗关断状态。nOE输入的操作不会影响锁存器的状态。

输入可通过3.3 V或5 V器件进行驱动。在3态操作中,输出能处理5 V的电压。这些特性允许在混合3.3 V和5 V环境中使用这些器件。

数据输入上的总线保持无需使用外部上拉电阻来保持未使用的输入。

特性和优势
    • 5 V容压输入/输出,可实现与5 V逻辑的接合
    • 1.2 V至3.6 V的宽电源电压范围
    • CMOS低功耗
    • Multibyte直通式标准针脚排列架构
    • 多个低电感电源针脚,可实现最低噪声和地弹
    • 具有TTL电平的直接接口
    • 所有数据输入都具有总线保持
    • VCC = 0 V时的高阻抗
    • 符合JEDEC标准:
      • JESD8-7A(1.65 V至1.95 V)
      • JESD8-5A(2.3 V至2.7 V)
      • JESD8-C/JESD36(2.7 V至3.6 V)
    • JESD8-7A(1.65 V至1.95 V)
    • JESD8-5A(2.3 V至2.7 V)
    • JESD8-C/JESD36(2.7 V至3.6 V)
    • ESD保护:
      • HBM JESD22-A114F超过2000 V
      • MM JESD22-A115-B超过200 V
      • CDM JESD22-C101E超过1000 V
    • HBM JESD22-A114F超过2000 V
    • MM JESD22-A115-B超过200 V
    • CDM JESD22-C101E超过1000 V
    • 额定温度范围为-40 °C至+85 °C和-40 °C至+125 °C
    • 采用塑封精细间距球栅阵列封装
产品图片
功能框图
Block diagram: 74LVCH32373AEC
关键参数
型号Product statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Package name
74LVCH32373AECProduction1.2 - 3.6TTL+/- 24332low-40~1256016.0LFBGA96
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
74LVCH32373AEC
LFBGA96
(SOT536-1)
sot536-1_posot536-1_frReel 13" Q1/T1 in Drypack量产CH32373A74LVCH32373AEC,518( 9352 644 48518 )
Tray, Bakeable, Multiple in Drypack量产CH32373A74LVCH32373AEC,557( 9352 644 48557 )
Tray, Bakeable, Single in Drypack量产CH32373A74LVCH32373AEC,551( 9352 644 48551 )
74LVCH32373AEC/G
LFBGA96
(SOT536-1)
sot536-1_posot536-1_frReel 13" Q1/T1 in Drypack量产CH32373A74LVCH32373AEC/G,5( 9352 811 41518 )
Tray, Bakeable, Multiple in Drypack量产CH32373A74LVCH32373AEC/G;5( 9352 811 41557 )
Tray, Bakeable, Single in Drypack量产CH32373A74LVCH32373AEC/G:5( 9352 811 41551 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
74LVCH32373AEC74LVCH32373AEC,518123.83.872.58E834
74LVCH32373AEC74LVCH32373AEC,557123.83.872.58E834
74LVCH32373AEC74LVCH32373AEC,551123.83.872.58E834
74LVCH32373AEC/G74LVCH32373AEC/G,5Always Pb-free123.83.872.58E8NA2
74LVCH32373AEC/G74LVCH32373AEC/G;5Always Pb-free123.83.872.58E8NA2
74LVCH32373AEC/G74LVCH32373AEC/G:5Always Pb-free123.83.872.58E8NA2
文档资料
档案名称标题类型格式日期
74LVCH32373A (中文)32-bit transparant D-type latch with 5 V tolerant inputs/outputs; 3-stateData sheetpdf2013-01-28
AN240Interfacing 3 Volt and 5 Volt ApplicationsApplication notepdf1995-09-15
AN263Power considerations when using CMOS and BiCMOS logic devicesApplication notepdf2002-02-05
AN11009Pin FMEA for LVC familyApplication notepdf2011-02-04
AN1026(LF)BGA Application note, ATO InnovationApplication notepdf2013-03-13
ANLFBGAANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) PackagesApplication notepdf2013-03-13
AN219A metastability primerApplication notepdf2013-03-13
AN212Package lead inductance considerations in high-speed applicationsApplication notepdf2013-03-13
AN10156Sorting through the low voltage logic mazeApplication notepdf2013-03-13
lvch32373alvch32373a IBIS modelIBIS modelibs2013-04-07
75017285Logic selection guide 2015Selection guidepdf2015-01-08
sot536-1_poplastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mmOutline drawingpdf2009-10-08
sot536-1_frFootprint for reflow soldering SOT536-1Reflow solderingpdf2009-10-08
订购信息
型号订购码 (12NC)可订购的器件编号
74LVCH32373AEC9352 644 4851874LVCH32373AEC,518
74LVCH32373AEC9352 644 4855774LVCH32373AEC,557
74LVCH32373AEC9352 644 4855174LVCH32373AEC,551
74LVCH32373AEC/G9352 811 4151874LVCH32373AEC/G,5
74LVCH32373AEC/G9352 811 4155774LVCH32373AEC/G;5
74LVCH32373AEC/G9352 811 4155174LVCH32373AEC/G:5
模型
标题类型日期
lvch32373a IBIS modelIBIS model2013-04-07
32-bit transparant D-type latch with 5 V tolerant inputs/outputs; 3-state 74LVCH32373AEC
74LVCH32373AEC
Interfacing 3 Volt and 5 Volt Applications 74LVC377PW
Power considerations when using CMOS and BiCMOS logic devices 74AHCT244PW
Pin FMEA for LVC family 74LVC1G123_Q100
(LF)BGA Application note, ATO Innovation 74LVC_H_16245A_Q100
ANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) Packages 74LVC_H_16245A_Q100
A metastability primer 74AHC573PW
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm 74LVTH32245EC
Footprint for reflow soldering SOT536-1 74LVTH32245EC
lvch32373a IBIS model 74LVCH32373AEC