Single low leakage current switching diode, encapsulated in a leadless ultra small DFN1006-2 (SOD882) Surface-Mounted Device (SMD) plastic package.
Name/Description | Modified Date |
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Low-leakage diode (REV 1.0) PDF (259.0 kB) BAS116L [English] | 04 May 2016 |
Name/Description | Modified Date |
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DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English] | 07 Nov 2012 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | VR max (V) | IFSM [max] (A) | IF max (mA) | VF [max] (mV) | Configuration | trr max (ns) | IR [max] (nA) | IFRM (mA) | VFmax (mV) | IR max (nA) | IFSM max (A) | trr [max] (ns) | IFRM (mA) | IF [max] (mA) | Cd max. (pF) | Cd [max] (pF) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BAS116L | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 75 | 4 | 1000@IF=10mA | single | 5@VR=75V | 700 | 3000 | 325 | 2 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAS116L | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAS116LYL (9340 698 11315) | J6 | BAS116L | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |