BAS70-06: General-purpose Schottky diodes
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| General-purpose Schottky diodes (REV 9.0) PDF (215.0 kB) BAS70_1PS7XSB70_SER | 28 Jan 2010 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAS70-06 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS70-06_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAS70-06 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAS70-06_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BAS70-06 SPICE model (REV 1.4) prm BAS70-06 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS70-06 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 0.1@VR=50V | dual c.a. | 750@IF=10mA | 0.1 | 2@VR=0V | 0.01@VR=70V | 70 | 70 | ||
| BAS70-06/G | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 0.1@VR=50V | dual c.a. | 750@IF=10mA | 0.1 | 2@VR=0V | 0.01@VR=70V | 70 | 70 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS70-06 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS70-06,215 (9340 208 20215) | 76% | BAS70-06 |    | week 34, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- General-purpose Schottky diodes BAS70XY
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS70-06 NXP Product Quality BAS70-06
- BAS70-06 NXP® Product Reliability BAS70-06
- BAS70-06 SPICE model BAS70-06
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
