Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package.
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Schottky barrier double diode (REV 1.1) PDF (178.0 kB) BAT54CM | 11 Nov 2009 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
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Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
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BAT54CM NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT54CM_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BAT54CM NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT54CM_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
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BAT54CM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 2 | dual c.c. | 800 | 0.6 | 10 | 30 | 200 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAT54CM | ![]() | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAT54CM,315 (9340 572 52315) | S3 | BAT54CM | ![]() ![]() ![]() | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |