Planar Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.
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Schottky barrier single diode (REV 1.0) PDF (51.0 kB) BAT54J | 08 Mar 2007 |
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Medium power small-signal MOSFETs in DC-to-DC conversion (REV 3.0) PDF (738.0 kB) AN11119 | 07 May 2013 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F | 08 Feb 2016 |
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Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 | 07 Nov 2012 |
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BAT54J NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT54J_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BAT54J NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT54J_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
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BAT54J | Active | SOD323F | SOD323F | 1.7 x 1.25 x 0.7 | 2@VR=25V | single | 400@IF=10mA | 0.6 | 10@VR=1V | 30 | 200 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAT54J | SOD323F | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BAT54J,115 (9340 609 34115) | AP | BAT54J | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |