Three internal (galvanic) isolated silicon epitaxial Schottky barrier diodes in a SOT363 small SMD plastic package.
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Schottky barrier triple diode (REV 2.1) PDF (145.0 kB) BAT754L | 22 Nov 2012 |
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Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board (REV 1.0) PDF (260.0 kB) AN10361 | 20 Jun 2005 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
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TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
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BAT754L NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT754L_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BAT754L NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT754L_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR [max] (V) | IR [max] (µA) | IF [max] (mA) | IFSM [max] (A) | Configuration | VF [max] (mV) | Cd [max] (pF) | IR [max] (mA) | VR (V) |
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BAT754L | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 30 | 2@VR=25V | 200 | 0.6 | triple isolated | 340@IF=10mA | 10@VR=1V |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BAT754L | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BAT754L,115 (9340 563 31115) | L1% | BAT754L | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |