BAV170QA: Dual common cathode low-leakage diode
Dual common cathode low-leakage diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
sot1215_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Dual common cathode low-leakage diode (REV 1.0) PDF (190.0 kB) BAV170QA [English] | 03 May 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BAV170QA SPICE model (REV 1.0) TXT BAV170QA_1 5/11/2016
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | VR max (V) | IFSM [max] (A) | IF max (mA) | Configuration | VF [max] (mV) | trr max (ns) | IR [max] (nA) | VFmax (mV) | IFRM (mA) | IR max (nA) | IFSM max (A) | trr [max] (ns) | IF [max] (mA) | IFRM (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAV170QA | Active | SOT1215 | DFN1010D-3 | 1.1 x 1.0 x 0.37 | 75 | 4 | dual c.c. | 1000@IF=10mA | 5@VR=75V | 1000 | 3000 | 320 | 2 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAV170QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BAV170QAZ (9340 698 14147) | Z 011 | BAV170QA |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- BAV170QA SPICE model BAV170QA
- DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
