NPN medium power transistor in a SOT1061 leadless very small Surface-Mounted Device (SMD) plastic package. PNP complement: BC52PA.
Name/Description | Modified Date |
---|---|
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA | 10 Nov 2011 |
Name/Description | Modified Date |
---|---|
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Name/Description | Modified Date |
---|---|
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 | 08 Feb 2016 |
Name/Description | Modified Date |
---|---|
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 | 07 Nov 2012 |
Name/Description | Modified Date |
---|---|
BC55-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-10PA | 31 Jan 2015 |
BC55-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-10PA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
---|---|
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | BC52-10PA | 1000 | NPN | 1650 | 60 | 180 | 160 | 63 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PA | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC55-10PA,115 (9340 658 07115) | BH | BC55-10PA | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |