BC55-16PA: 60 V, 1 A NPN medium power transistor
NPN medium power transistor in a SOT1061 leadless very small Surface-Mounted Device (SMD) plastic package. PNP complement: BC52PA.
Outline 3d SOT1061
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA | 10 Nov 2011 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC55-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-16PA | 31 Jan 2015 |
| BC55-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-16PA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BC55-16PA SPICE model (REV 1.4) prm BC55-16PA_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-16PA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | BC52-16PA | 1000 | NPN | 1650 | 60 | 180 | 250 | 100 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-16PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC55-16PA,115 (9340 658 08115) | BJ | BC55-16PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BC55-16PA NXP® Product Reliability BC55-16PA
- BC55-16PA NXP Product Quality BC55-16PA
- BC55-16PA SPICE model BCP55_BCX55_BC55PA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- PTVSXU1UPA_SERIES
