BC55-16PA: 60 V, 1 A NPN medium power transistor

NPN medium power transistor in a SOT1061 leadless very small Surface-Mounted Device (SMD) plastic package. PNP complement: BC52PA.

Outline 3d SOT1061
Data Sheets (1)
Name/DescriptionModified Date
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA10 Nov 2011
Brochures (1)
Name/DescriptionModified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 7501766026 May 2015
Package Information (1)
Name/DescriptionModified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT106108 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
BC55-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-16PA31 Jan 2015
BC55-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-16PA_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)Ptot (mW)ComplementIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]
BC55-16PAActiveSOT1061DFN2020-32 x 2 x 0.65BC52-16PA1000NPN165060180250100
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
BC55-16PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC55-16PA,115 (9340 658 08115)BJBC55-16PAAlways Pb-free153.00.711.41E911
60 V, 1 A NPN medium power transistors BCX55-16
Medium-power general-purpose transistors BSR43
BC55-16PA NXP® Product Reliability BC55-16PA
BC55-16PA NXP Product Quality BC55-16PA
BC55-16PA SPICE model BCP55_BCX55_BC55PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES