BC817DS: NPN general purpose double transistor
NPN transistor pair in a SOT457 (SC-74) plastic package.
BC817DS: Product Block Diagram
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| NPN general purpose double transistor (REV 2.0) PDF (129.0 kB) BC817DS | 22 Nov 2002 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC817DS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817DS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC817DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC817DS_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BC817DS SPICE model (REV 1.4) prm BC817DS_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Configuration | VCEO [max] (V) | IC max (mA) | hFE [min] | hFE max | IC [max] (mA) | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 600 | 2 | 45 | 160 | 500 | 400 | NPN |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BC817DSF (9340 573 19135) | N3 | BC817DS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BC817DS,115 (9340 573 19115) | N3 | BC817DS | | week 22, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC817DS NXP Product Quality BC817DS
- BC817DS NXP® Product Reliability BC817DS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- Letter Symbols - Transistors; General PEMD16
- BC817DS SPICE model BC817DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- BC817DS
- SSL5021_SSL5031
