BC847CM: 45 V, 100 mA NPN general-purpose transistors

NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.

SOT883
Data Sheets (1)
Name/DescriptionModified Date
45 V, 100 mA NPN general-purpose transistors (REV 9.0) PDF (211.0 kB) BC847_SER23 Sep 2014
Application Notes (1)
Name/DescriptionModified Date
18 W CFL lamp design using UBA2024 application development tool and application examples (REV 4.0) PDF (740.0 kB) AN1071311 Feb 2011
Users Guides (4)
Name/DescriptionModified Date
UBA2024AP DIP8 18W demo board (REV 3.0) PDF (359.0 kB) UM1038827 Jan 2011
UBA2024AT SO14 18 W demo board (REV 3.0) PDF (180.0 kB) UM1038726 Jan 2011
UBA2024T SO14 13W demo board (REV 3.0) PDF (178.0 kB) UM1039226 Jan 2011
UBA2024P DIP8 13 W demo board (REV 3.0) PDF (355.0 kB) UM1039326 Jan 2011
Brochures (1)
Name/DescriptionModified Date
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 7501654301 Jun 2008
Package Information (1)
Name/DescriptionModified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT88308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_31522 Jul 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
BC847CM NXP Product Quality (REV 1.2) PDF (74.0 kB) BC847CM_NXP_PRODUCT_QUALITY31 Jan 2015
BC847CM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC847CM_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Design Support
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)ComplementPtot (mW)ConfigurationIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]fr [min] (MHz)hFE [min]
BC847CMActiveSOT883DFN1006-31.0 x 0.6 x 0.54301100NPN45800420
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
BC847CMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveBC847CM,315 (9340 571 51315)D6BC847CMAlways Pb-free153.00.711.41E911
45 V, 100 mA NPN general-purpose transistors BC847W
18 W CFL lamp design using UBA2024 application development tool and application examples BAV70W
UBA2024AP DIP8 18W demo board BC858W
UBA2024AT SO14 18 W demo board BC858W
UBA2024T SO14 13W demo board BC858W
UBA2024P DIP8 13 W demo board BC858W
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
BC847CM NXP Product Quality BC847CM
BC847CM NXP® Product Reliability BC847CM
Letter Symbols - Transistors; General PEMD16
BC847CM SPICE model BC847CM
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PMZ950UPE