BC857QAS: 45 V, 100 mA PNP/PNP general-purpose transistor
PNP/PNP general-purpose transistor in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package.
NPN/NPN complement: BC847QAS.
NPN/PNP complement: BC847QAPN.
sot1216_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 100 mA PNP/PNP general-purpose transistor (REV 2.0) PDF (199.0 kB) BC857QAS | 08 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals (REV 1.0) PDF (199.0 kB) SOT1216 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN1010B-6; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... (REV 1.0) PDF (202.0 kB) SOT1216_147 | 06 Oct 2015 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC857QAS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857QAS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC857QAS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857QAS_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BC857QAS SPICE model (REV 1.0) TXT BC857QAS_1 8/13/2014
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Configuration | VCEO [max] (V) | IC max (mA) | hFE [min] | hFE max | IC [max] (mA) | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857QAS | Active | SOT1216 | DFN1010B-6 | 1.1 x 1.0 x 0.37 | 230 | 2 | -45 | 200 | -100 | 450 | 100 | PNP |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857QAS | | SOT1216 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC857QASZ (9340 687 23147) | 10 01 00 | BC857QAS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC857QAS NXP Product Quality BC857QAS
- BC857QAS NXP® Product Reliability BC857QAS
- BC857QAS SPICE model BC857QAS
- DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals BC857QAS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN1010B-6; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... BC857QAS
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
