BC860C: PNP general purpose transistors
PNP transistor in a SOT23 plastic package.
NPN complements: BC849 and BC850.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP general purpose transistors (REV 5.0) PDF (131.0 kB) BC859_BC860 | 16 Jan 2004 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC860C NXP Product Quality (REV 1.2) PDF (74.0 kB) BC860C_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC860C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC860C_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BC860C SPICE model (REV 1.4) prm BC860C 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | hFE min | VCEO [max] (V) | hFE max | Configuration | fT min (MHz) | Complement | hFE [min] | IC max (mA) | IC [max] (mA) | hFE [max] | VCEO max (V) | fT [min] (MHz) | Ptot max (mW) | fr [min] (MHz) | Polarity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC860C | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 250 | 420 | -45 | 800 | 1 | 100 | BC850C | 420 | 100 | -100 | 800 | 45 | 250 | PNP | ||
| BC860C/A2 | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 250 | -45 | 1 | 420 | -100 | 800 | PNP |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC860C | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BC860C,235 (9336 287 00235) | 4G% | BC860C |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BC860C,215 (9336 287 00215) | 4G% | BC860C | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC860C NXP Product Quality BC860C
- BC860C NXP® Product Reliability BC860C
- Letter Symbols - Transistors; General PEMD16
- BC860C SPICE model BC860C
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
