NPN medium power transistor in a SOT89 Surface-Mounted Device (SMD) plastic package. PNP complement: BC869.
Name/Description | Modified Date |
---|---|
20 V, 2A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP68_BC868_BC68PA | 02 Nov 2011 |
Name/Description | Modified Date |
---|---|
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Name/Description | Modified Date |
---|---|
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
Name/Description | Modified Date |
---|---|
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 | 28 Nov 2012 |
Name/Description | Modified Date |
---|---|
BC868-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868-25_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BC868-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868-25_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC868-25 | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | BC869-25 | 2000 | NPN | 1350 | 20 | 145 | 375 | 160 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC868-25 | SOT89 | Reel 7" Q1/T1 | Active | BC868-25,115 (9340 053 80115) | CDC | BC868-25 | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |