BCP52: 60 V, 1 A PNP medium power transistor _ BDTIC a Leading Distributor in China

BCP52: 60 V, 1 A PNP medium power transistor

PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complement: BCP55.

SOT223

Data Sheets (1)

Name/Description	Modified Date
60 V, 1 A PNP medium power transistors (REV 9.0) PDF (1.1 MB) BCP52_BCX52_BC52PA	07 Nov 2011

Application Notes (1)

Name/Description	Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405	06 Jan 2006

Brochures (1)

Name/Description	Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660	26 May 2015

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135	07 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
BCP52 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP52_NXP_PRODUCT_QUALITY	31 Jan 2015
BCP52 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP52_NXP_PRODUCT_RELIABILITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999

SPICE model

BCP52 SPICE model (REV 1.4) prm BCP52 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Complement	P_tot (mW)	I_C [max] (mA)	Polarity	I_C max (mA)	P_tot [max] (mW)	V_CEO [max] (V)	hFE max	f_T [min] (MHz)	h_FE [max]	h_FE [min]
BCP52	Active	SOT223	SC-73	6.5 x 3.5 x 1.65	BCP55		1000	PNP		1350	60		145	250	40

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
BCP52		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BCP52,135 (9339 173 00135)	BCP52	BCP52		week 34, 2003	153.0	0.71	1.41E9	1	1

60 V, 1 A PNP medium power transistors BCX52-16

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

Medium-power general-purpose transistors BSR43

BCP52 NXP Product Quality BCP52

BCP52 NXP® Product Reliability BCP52

Letter Symbols - Transistors; General PEMD16

BCP52 SPICE model BCP52_BCX52_BC52PA

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

BLT81

©1993 - 2024 BDTIC