BCP54; BCX54; BC54PA: 45 V, 1 A NPN medium power transistors
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.1 MB) BCP54_BCX54_BC54PA [English] | 07 Nov 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
Packing (5)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
Reliability and Quality Information (18)
| Name/Description | Modified Date |
|---|---|
| BC54-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54-10PA [English] | 31 Jan 2015 |
| BC54-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54-10PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC54-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54-16PA [English] | 31 Jan 2015 |
| BC54-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC54PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC54PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP54-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP54-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP54-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP54-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP54 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP54 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX54-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX54-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX54-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX54-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX54 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX54 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE model
- BC54-10PA SPICE model (REV 1.4) prm BC54-10PA_1 7/22/2012
- BC54-16PA SPICE model (REV 1.4) prm BC54-16PA_1 7/22/2012
- BC54PA SPICE model (REV 1.4) prm BC54PA 7/22/2012
- BCP54 SPICE model (REV 1.4) prm BCP54 7/22/2012
- BCP54-10 SPICE model (REV 1.4) prm BCP54-10 7/22/2012
- BCP54-16 SPICE model (REV 1.4) prm BCP54-16 7/22/2012
- BCX54 SPICE model (REV 1.4) prm BCX54 7/22/2012
- BCX54-10 SPICE model (REV 1.4) prm BCX54-10 7/22/2012
- BCX54-16 SPICE model (REV 1.4) prm BCX54-16 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| BC54PA | Active |
| BCX54-10 | Active |
| BCP54 | Active |
| BC54-10PA | Active |
| BCX54 | Active |
| BCX54-16 | Active |
| BC54-16PA | Active |
| BCP54-10 | Active |
| BCP54-16 | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCX54-10 | | SOT89 | Reel 7" Q1/T1 | Active | BCX54-10,115 (9336 630 70115) | BC | BCX54-10 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BCX54 | | SOT89 | Reel 7" Q1/T1 | Active | BCX54,115 (9332 723 10115) | BA | BCX54 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BCX54-16 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX54-16,135 (9336 747 40135) | BD | BCX54-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX54-16,115 (9336 747 40115) | BD | BCX54-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP54 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP54,135 (9339 171 80135) | BCP54 | BCP54 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP54,115 (9339 171 80115) | BCP54 | BCP54 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC54PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC54PA,115 (9340 657 38115) | AT | BC54PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC54-10PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC54-10PA,115 (9340 658 05115) | BF | BC54-10PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP54-16 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP54-16,135 (9339 172 00135) | BCP54/16 | BCP54-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP54-16,115 (9339 172 00115) | BCP54/16 | BCP54-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP54-10 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP54-10,135 (9339 171 90135) | BCP54/10 | BCP54-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC54-16PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC54-16PA,115 (9340 658 06115) | BG | BC54-16PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BC54-10PA NXP® Product Reliability BC54-10PA
- BC54-10PA NXP Product Quality BC54-10PA
- BC54-16PA NXP® Product Reliability BC54-16PA
- BC54-16PA NXP Product Quality BC54-16PA
- BC54PA NXP Product Quality BC54PA
- BC54PA NXP® Product Reliability BC54PA
- BCP54-10 NXP Product Quality BCP54-10
- BCP54-10 NXP® Product Reliability BCP54-10
- BCP54-16 NXP Product Quality BCP54-16
- BCP54-16 NXP® Product Reliability BCP54-16
- BCP54 NXP Product Quality BCP54
- BCP54 NXP® Product Reliability BCP54
- BCX54-10 NXP Product Quality BCX54-10
- BCX54-10 NXP® Product Reliability BCX54-10
- BCX54-16 NXP Product Quality BCX54-16
- BCX54-16 NXP® Product Reliability BCX54-16
- BCX54 NXP Product Quality BCX54
- BCX54 NXP® Product Reliability BCX54
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BC54-10PA SPICE model BCP54_BCX54_BC54PA
- BC54-16PA SPICE model BCP54_BCX54_BC54PA
- BC54PA SPICE model BCP54_BCX54_BC54PA
- BCP54 SPICE model BCP54_BCX54_BC54PA
- BCP54-10 SPICE model BCP54-10
- BCP54-16 SPICE model BCP54-16
- BCX54 SPICE model BCX54
- BCX54-10 SPICE model BCX54-10
- BCX54-16 SPICE model BCX54-16
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- BFU590Q
- BLT81
- PTVSXU1UPA_SERIES
