BCP55: 60 V, 1 A NPN medium power transistor _ BDTIC a Leading Distributor in China

BCP55: 60 V, 1 A NPN medium power transistor

NPN medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. PNP complement: BCP52.

SOT223

Data Sheets (1)

Name/Description	Modified Date
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA	10 Nov 2011

Application Notes (1)

Name/Description	Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405	06 Jan 2006

Brochures (1)

Name/Description	Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660	26 May 2015

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223	08 Feb 2016

Packing (2)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115	07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135	07 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
BCP55 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55_NXP_PRODUCT_QUALITY	31 Jan 2015
BCP55 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55_NXP_PRODUCT_RELIABILITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999

SPICE model

BCP55 SPICE model (REV 1.4) prm BCP55 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Complement	P_tot (mW)	I_C [max] (mA)	Polarity	I_C max (mA)	P_tot [max] (mW)	V_CEO [max] (V)	hFE max	f_T [min] (MHz)	h_FE [max]	h_FE [min]
BCP55	Active	SOT223	SC-73	6.5 x 3.5 x 1.65	BCP52		1000	NPN		1350	60		180	250	40
BCP55/A	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP55/A2	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP55/R	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
BCP55		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BCP55,135 (9339 172 10135)	BCP55	BCP55		week 34, 2003	153.0	0.71	1.41E9	1	1
BCP55		SOT223		Reel 7" Q1/T1	Active	BCP55,115 (9339 172 10115)	BCP55	BCP55		week 34, 2003	153.0	0.71	1.41E9	1	1

60 V, 1 A NPN medium power transistors BCX55-16

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

Medium-power general-purpose transistors BSR43

BCP55 NXP Product Quality BCP55

BCP55 NXP® Product Reliability BCP55

Letter Symbols - Transistors; General PEMD16

BCP55 SPICE model BCP55_BCX55_BC55PA

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A

BLT81

©1993 - 2024 BDTIC