BCP69-16: 20 V, 2 A PNP medium power transistor _ BDTIC a Leading Distributor in China

BCP69-16: 20 V, 2 A PNP medium power transistor

PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complement: BCP68.

BCP69-16: Product Block Diagram

BCP69-16: Block Diagram

SOT223

Data Sheets (1)

Name/Description	Modified Date
20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA	20 Oct 2011

Brochures (1)

Name/Description	Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660	26 May 2015

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223	08 Feb 2016

Packing (2)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115	07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135	07 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
BCP69-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-16_NXP_PRODUCT_QUALITY	31 Jan 2015
BCP69-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-16_NXP_PRODUCT_RELIABILITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999

SPICE model

BCP69-16 SPICE model (REV 1.4) prm BCP69-16 7/22/2012

Software

BCP69_1_2 (REV 0.1) olb BCP69_1_2 11/21/2008

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Complement	P_tot (mW)	I_C [max] (mA)	Polarity	I_C max (mA)	P_tot [max] (mW)	V_CEO [max] (V)	hFE max	f_T [min] (MHz)	h_FE [max]	h_FE [min]
BCP69-16/ZL	Active	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP69-16	Active	SOT223	SC-73	6.5 x 3.5 x 1.65	BCP68-16		1000	PNP		1350	20		140	250	100
BCP69-16/A	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP69-16/G	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
BCP69-16		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	BCP69-16,115 (9340 094 30115)	BCP69/16	BCP69-16		week 34, 2003	153.0	0.71	1.41E9	1	1
BCP69-16		SOT223		Reel 11¼" Q1/T1 in LargePack	Active	BCP69-16F (9340 094 30135)	BCP69/16	BCP69-16			153.0	0.71	1.41E9
BCP69-16/ZL		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BCP69-16/ZLF (9340 707 67135)	Standard Marking	BCP69-16/ZL			153.0	0.71	1.41E9
BCP69-16/ZL		SOT223		Reel 7" Q1/T1	Active	BCP69-16/ZLX (9340 707 67115)	Standard Marking	BCP69-16/ZL			153.0	0.71	1.41E9

20 V, 2 A PNP medium power transistors BCP69-25

Medium-power general-purpose transistors BSR43

BCP69-16 NXP Product Quality BCP69-16

BCP69-16 NXP® Product Reliability BCP69-16

Letter Symbols - Transistors; General PEMD16

Power Derating Curves for SMDs; General BST62

BCP69-16 SPICE model BCP69-16

BCP69_1_2 BCP69-25

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A

PBHV9115Z

PBHV9115Z

BLT81

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