NPN medium power transistor in a SOT89 Surface-Mounted Device (SMD) plastic package. PNP complement: BCX52.
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60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA | 10 Nov 2011 |
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Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 | 06 Jan 2006 |
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Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
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plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 | 28 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 | 28 Nov 2012 |
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BCX55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55-16_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BCX55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55-16_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Product | Status | Package version | Package name | Size (mm) | Complement | Ptot (mW) | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
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BCX55-16 | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | BCX52-16 | 1000 | NPN | 1350 | 60 | 180 | 250 | 100 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BCX55-16 | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX55-16,135 (9336 747 50135) | BM | BCX55-16 | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |||
Reel 7" Q1/T1 | Active | BCX55-16,115 (9336 747 50115) | BM | BCX55-16 | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |