NPN high-voltage transistor in a SOT89 plastic package.
PNP complements: BF621 and BF623.
Name/Description | Modified Date |
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NPN high-voltage transistors (REV 4.0) PDF (125.0 kB) BF620_622 | 14 Dec 2004 |
Name/Description | Modified Date |
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plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 | 28 Nov 2012 |
Name/Description | Modified Date |
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BF622 NXP Product Quality (REV 1.2) PDF (74.0 kB) BF622_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BF622 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF622_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Product | Status | Package version | Package name | Size (mm) | hFE min | Ptot (mW) | hFE max | Configuration | VCEO [max] (V) | fT min (MHz) | hFE [min] | Complement | IC max (mA) | IC [max] (mA) | hFE [max] | VCEO max (V) | fT [min] (MHz) | Ptot max (mW) | fr [min] (MHz) | Polarity |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BF622 | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | 50 | 1250 | >50 | 1 | 250 | 60 | 50 | BF623 | 50 | 50 | 250 | 1250 | NPN |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BF622 | SOT89 | Reel 7" Q1/T1 | Active | BF622,115 (9333 878 60115) | DA | BF622 | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |