BGA2012: 1900 MHz high linear low noise amplifier
Silicon Monolitic Microwave Integrated Circuit (MMIC) amplifier consisting of an NPN double polysilicon transistor with integrated biasing.
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 1900 MHz high linear low noise amplifier (REV 2.1) PDF (316.0 kB) BGA2012 | 01 Mar 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| High IP3 MMIC LNA at 1.8-2.4 GHz (REV 1.0) PDF (68.0 kB) BGA2012_LNA_18_24GHZ | 30 May 2001 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
SPICE model
- BGA2012 SPICE model (REV 1.3) prm BGA2012_1 6/8/2012
S-Parameters
- S-parameter BGA2012 (REV 1.0) ZIP SPAR_BGA2012 6/6/2012
Ordering Information
| Product | Status | Status | Budgetary Price excluding tax(US$) | Package Type and Termination Count | GPIOs | Qualification Tier |
|---|---|---|---|---|---|---|
| BGA2012 | Active | |||||
| BGA2012/DB1 | No Longer Manufactured |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA2012 | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BGA2012,115 (9340 563 66115) | A6% | BGA2012 |    | week 23, 2003 | NA | NA |
- High IP3 MMIC LNA at 1.8-2.4 GHz bga2012
- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- MAR_SOT363 Topmark BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- S-parameter BGA2012 BGA2012
- BGA2012 SPICE model BGA2012
