The BGU7258 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 5 GHz to 6 GHz ISM band. Manufactured in NXP’s high performance SiGe:C technology, the BGU7258 couples best-in-class gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7258 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external components, makes the circuit board implementation of the BGU7258 LNA the smallest IEEE 802.11ac LNA with bypass solution on the market, ideal for space sensitive applications.
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5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass (REV 2.0) PDF (414.0 kB) BGU7258 | 30 Oct 2014 |
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BGU7258 802.11 a/n/ac Low Noise Amplifier 5-6 GHz WiFi LNA MMIC with Bypass (REV 2.0) PDF (1.2 MB) AN11453 | 18 Mar 2016 |
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DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (190.0 kB) SOT1189-1 | 08 Feb 2016 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Status | Budgetary Price excluding tax(US$) | Package Type and Termination Count | GPIOs | Qualification Tier |
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BGU7258 | Active |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
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BGU7258 | SOT1189-1 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BGU7258X (9340 677 73115) | Standard Marking | BGU7258 | Always Pb-free | 1 | 1 |