BLF10H6600PS:功率LDMOS晶体管

600W LDMOS RF功率晶体管,适合发射器应用和工业应用。该器件凭借其出色的耐用性而非常适合数字和模拟发射器应用。

特性和优势
    • 极佳的强度(所有相位的VSWR ≥ 40 : 1)
    • 最佳热性能和可靠性,Rth(j-c) = 0.15 K/W
    • 高功率增益
    • 高效率
    • 设计用于宽带操作(400 MHz至1000 MHz)
    • 内部输入匹配,可实现高增益和最佳宽带操作
    • 极佳的可靠性
    • 方便的功率控制
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 通信发射器应用
    • 工业应用
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range4001000MHz
PL(1dB)nominal output power at 1 dB gain compression600W
Gppower gainVDS = 50 V; f1 = 860 MHz; f2 = 860.1 MHz19.820.8dB
ηDdrain efficiencyVDS = 50 V; IDq = 1.3 A; f1 = 860 MHz; f2 = 860.1 MHz;4246%
PL(AV)average output powerf1 = 860 MHz; f2 = 860.1 MHz250W
IMD3third-order intermodulation distortionVDS = 50 V; IDq = 1.3 A; f1 = 860 MHz; f2 = 860.1 MHz-32-28dBc
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLF10H6600PS

(SOT539B)
sot539b_poBulk Pack量产Standard MarkingBLF10H6600PSU( 9340 676 48112 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1D1drain1
2D2drain2
3G1gate1
4G2gate2
5Ssouce
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLF10H6600PSBLF10H6600PSUAlways Pb-freeNANA
文档资料
档案名称标题类型格式日期
BLF10H6600P_BLF10H6600PS (中文)Power LDMOS transistorData sheetpdf2013-07-02
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
PCB_Design_BLF10H6600P_BLF10H6600PS_Data-sheetPCB Design BLF10H6600P(S) (Data sheet)Design supportzip2013-07-02
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot539b_poearless flanged balanced ceramic package; 4 leadsOutline drawingpdf2012-05-08
订购信息
型号订购码 (12NC)可订购的器件编号
BLF10H6600PS9340 676 48112BLF10H6600PSU
其它
标题类型日期
PCB Design BLF10H6600P(S) (Data sheet)Design support2013-07-02
Power LDMOS transistor BLF10H6600P_S
Power LDMOS transistor BLF10H6600P_S
Power LDMOS transistor BLF10H6600P_S
Mounting and Soldering of RF transistors aerospace_defense
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
earless flanged balanced ceramic package; 4 leads BLU6H0410L_S_600P
PCB Design BLF10H6600P(S) (Data sheet) BLF10H6600P_S