BLP10H605：宽带LDMOS驱动器晶体管
5 W塑料LDMOS功率晶体管，适合于频率范围为HF至1400 MHz的广播发射器和ISM应用。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 10 | 1400 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 5 | W | |||
| Gp | power gain | PL = 5 W; VDS = 50 V | 20.2 | 22.4 | 27.4 | dB |
| ηD | drain efficiency | PL = 5 W; VDS = 50 V; f = 860 MHz; IDq = 30 mA | 57 | 59.6 | % |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLP10H605 |  HVSON12 (SOT1352-1) | sot1352-1_po | sot1352-1_fr | Reel 7" Q1/T1 in DryPack, SmallPack | 量产 | Standard Marking | BLP10H605AZ( 9340 682 14531 ) |
| Reel 7" Q1/T1 in Drypack | 量产 | Standard Marking | BLP10H605Z( 9340 682 14515 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | n.c. | not connected |  |  |
| 2 | GATE1 | gate1 | ||
| 3 | n.c. | not connected | ||
| 4 | n.c. | not connected | ||
| 5 | GATE2 | gate2 | ||
| 6 | n.c. | not connected | ||
| 7 | n.c. | not connected | ||
| 8 | DRAIN2 | drain2 | ||
| 9 | n.c. | not connected | ||
| 10 | n.c. | not connected | ||
| 11 | DRAIN1 | drain1 | ||
| 12 | n.c. | not connected | ||
| 13 | SOURCE | source |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLP10H605 | BLP10H605AZ |   | Always Pb-free | 3 | 3 |
| BLP10H605 | BLP10H605Z | | week 18, 2014 | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLP10H605 (中文) | Broadband LDMOS driver transistor | Data sheet | 2014-10-02 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| AN11520 | Life-time requirements of NXP Semiconductors HVSON12 plastic drivers | Application note | 2014-04-04 | |
| PCB_Design_BLP10H605_Data-sheet | PCB Design BLP10H605 (Data sheet) | Design support | zip | 2014-09-01 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| RFPower_Longevity_Overview | RF Power Longevity Overview | Other type | 2014-09-09 | |
| NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
| NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 | |
| NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
| sot1352-1_po | plastic thermal enhanced very thin small outline package; no leads; 12 terminals | Outline drawing | 2013-03-27 | |
| sot1352-1_fr | Footprint for reflow soldering SOT1352-1 | Reflow soldering | 2013-06-05 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLP10H605 | 9340 682 14531 | BLP10H605AZ |
| BLP10H605 | 9340 682 14515 | BLP10H605Z |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| RF Power Model Library for Microwave Office® | Simulation model | 2014-11-11 |
| RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 |
| RF Power Simulation Example for Microwave Office® | Simulation model | 2012-06-11 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLP10H605 (Data sheet) | Design support | 2014-09-01 |
- Broadband LDMOS driver transistor BLP10H605
- Mounting and Soldering of RF transistors aerospace_defense
- Life-time requirements of NXP Semiconductors HVSON12 plastic drivers BLP10H610
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- RF Power Longevity Overview gan_devices
- plastic thermal enhanced very thin small outline package; no leads; 12 terminals BLP10H610
- Footprint for reflow soldering SOT1352-1 BLP10H610
- RF Power Model Library for Microwave Office® CLF1G0060_S_30
- RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30
- RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
- PCB Design BLP10H605 (Data sheet) BLP10H605
