NPN medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. PNP complements: BSP31; BSP32 and BSP33.
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NPN medium power transistors (REV 4.0) PDF (106.0 kB) BSP41_43 | 26 Apr 1999 |
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Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
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plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
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BSP41 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP41_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BSP41 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP41_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | hFE [max] | hFE [min] | fT [min] (MHz) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BSP41 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | BSP31 | 1000 | NPN | 1350 | 60 | 300 | 100 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BSP41 | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP41,115 (9339 820 10115) | BSP41 | BSP41 | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |