AN11130 | Bias module for 50 V GaN demonstration boards | Application note | pdf | 2011-12-08 |
PCB_Design_CLF1G0035-100_1G0035S-100_Data-sheet | PCB Design CLF1G0035(S)-100 (Data sheet) | Design support | zip | 2014-08-18 |
fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | pdf | 2009-10-08 |
NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | pdf | 2015-05-19 |
RFPower_Longevity_Overview | RF Power Longevity Overview | Other type | pdf | 2014-09-09 |
Application_Measurement_Report_CLF1G0035-100_3100-3500MHz_NA-1766 | Application Measurement Report CLF1G0035-100 3100-3500 MHz NA-1766 | Report | pdf | 2015-06-23 |
NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | pdf | 2014-11-11 |
CLF1G0035-100_ADS-2009_Model | CLF1G0035-100 ADS-2009 Model | Simulation model | zip | 2013-03-04 |
NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
CLF1G0035-100_ADS-2011_Model | CLF1G0035-100 ADS-2011 Model | Simulation model | zip | 2013-03-04 |
NXP_CLF1G0035_100_V0p7_Spar_Vgs_2n2_Vd_50_Idq_330mA_10Mto8GHz | CLF1G0035-100 50V 330mA S-parameter Data | S-parameter | s2p | 2012-04-04 |
sot467c_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | pdf | 1999-12-27 |
SOT467C_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | pdf | 2012-11-30 |
sot467b_po | earless ceramic package; 2 leads | Outline drawing | pdf | 2012-05-08 |