HTMS1x01; HTMS8x01: HITAG® µ (ISO14223) and (ISO11784/85) Transponder IC
The HITAG® product line is well known and established in the contactless identification market.
Due to the open marketing strategy of NXP® Semiconductors there are various manufacturers well established for both the transponders/cards as well as the read/write devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.
With the new HITAG μ family, this existing infrastructure is extended with the next generation of ICs being substantially smaller in mechanical size, lower in cost, offering more operation distance and speed, but still being operated with the same reader infrastructure and transponder manufacturing equipment.
The protocol and command structure for HITAG μ is design to support Reader Talks First (RTF) operation, including anti-collision algorithm.
Different memory sizes are offered and can be operated using exactly the same protocol.
The ISO standards ISO 11784 and ISO 11785 are well established in this market and HITAG μ is especially designed to deliver the optimum performance compliant to these standards. The HITAG μ advanced ICs are offering additional memory for storage of customized offline data like further breeding details.
Within the dedicated CAS team within the BU Identification
Accompanying data sheets and application notes:
http://www.nxp.com/HITAG
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| HITAG® µ transponder IC (REV 3.4) PDF (451.0 kB) HTMS1X01_8X01 | 22 May 2015 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| RFID for brand protection - secure your most valuable assets & increase customer engagement (REV 1.0) PDF (4.7 MB) 75017595 | 17 Dec 2014 |
Package Information (2)
| Name/Description | Modified Date |
|---|---|
| plastic extremely thin small outline package; no leads; 3 terminals (REV 1.0) PDF (188.0 kB) SOT1122 | 08 Feb 2016 |
| plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm (REV 1.0) PDF (169.0 kB) SOT899-1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| HVSON2; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (342.0 kB) SOT899-1_115 | 24 Sep 2012 |
Ordering Information
| Product |
|---|
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HTMS8101FTB/AF | | SOT1122 | Reel 7" Q1/T1 | Active | HTMS8101FTB/AF,115 (9352 900 72115) | Standard Marking | HTMS8101FTB/AF |    | Always Pb-free | 1 | 1 | |
| HTMS8001FTB/AF | | SOT1122 | Reel 7" Q1/T1 | Active | HTMS8001FTB/AF,115 (9352 900 71115) | Standard Marking | HTMS8001FTB/AF | | Always Pb-free | 1 | 1 | |
| Bulk Pack | Active | HTMS8001FTB/AF,148 (9352 900 71148) | Standard Marking | HTMS8001FTB/AF | | Always Pb-free | 1 | 1 | ||||
| HTMS8101FTK/AF |  | SOT899-1 | Reel 7" Q1/T1 | Active | HTMS8101FTK/AF,115 (9352 901 36115) | Standard Marking | HTMS8101FTK/AF | | Always Pb-free | 1 | 1 | |
| HTMS8201FTK/AF | | SOT899-1 | Reel 7" Q1/T1 | Active | HTMS8201FTK/AF,115 (9352 901 37115) | Standard Marking | HTMS8201FTK/AF | | Always Pb-free | 1 | 1 | |
| HTMS8001FTK/AF | | SOT899-1 | Reel 7" Q1/T1 | Active | HTMS8001FTK/AF,115 (9352 901 35115) | Standard Marking | HTMS8001FTK/AF | | Always Pb-free | 1 | 1 | |
| HTMS8201FUG/AM |  | Wafer, Sawn on FFC, Non-Conductive | Active | HTMS8201FUG/AM,005 (9352 887 12005) | Standard Marking | HTMS8201FUG/AM |  | Always Pb-free | NA | NA | ||
| HTMS1001FUG/AM | | Die In Waffle Carriers 2" | Samples Available | HTMS1001FUG/AM,026 (9352 887 02026) | Standard Marking | HTMS1001FUG/AM | | Always Pb-free | NA | NA | ||
| Wafer, Sawn on FFC, Non-Conductive | Active | HTMS1001FUG/AM,005 (9352 887 02005) | Standard Marking | HTMS1001FUG/AM | | Always Pb-free | NA | NA | ||||
| HTMS8201FTB/AF | | SOT1122 | Reel 7" Q1/T1 | Active | HTMS8201FTB/AF,115 (9352 900 73115) | Standard Marking | HTMS8201FTB/AF | | Always Pb-free | 1 | 1 | |
| HTMS8101FUG/AM | | Wafer, Sawn on FFC, Non-Conductive | Active | HTMS8101FUG/AM,005 (9352 887 11005) | Standard Marking | HTMS8101FUG/AM | | Always Pb-free | NA | NA | ||
| HTMS8001FUG/AM | | Wafer, Sawn on FFC, Non-Conductive | Active | HTMS8001FUG/AM,005 (9352 887 09005) | Standard Marking | HTMS8001FUG/AM | | Always Pb-free | NA | NA | ||
| Wafer, Sawn on FFC, Non-Conductive | Active | HTMS8001FUG/AM,003 (9352 887 09003) | Standard Marking | HTMS8001FUG/AM | | Always Pb-free | NA | NA |
- HITAG® µ transponder IC HTMS1X01_HTMS8X01
- RFID for brand protection - secure your most valuable assets & increase customer engagement htrc11001t
- plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm HTSX
- HVSON2; reel pack; standard product orientation; 12NC ending 115 HTMS1X01_HTMS8X01
- plastic extremely thin small outline package; no leads; 3 terminals HTMS1X01_HTMS8X01
- HTSX
- HTMS1X01_HTMS8X01
