The LPC1778 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz. Features include 512 kB of flash memory, 96 kB of data memory, Ethernet, USB 2.0 device/host/OTG , 8-channel DMA controller, 5 UARTs, 2 CAN channels, 3 SSP/SPI, 3 I2C, I2S, 8-channel 12-bit ADC, 10-bit DAC, QEI, SD/MMC, motor control PWM, 4 general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock with separate battery supply, and up to 141 general purpose I/O pins.
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32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC (REV 5.5) PDF (2.4 MB) LPC178X_7X | 26 Apr 2016 |
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Errata sheet LPC177x/8x (REV 4.1) PDF (189.0 kB) ES_LPC177X_8X | 19 Feb 2015 |
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AN_LPC177x_8x_Secondary_USB_Host_Bootloader (REV 1.1) ZIP (3.4 MB) AN11628 | 06 Mar 2015 |
AES encryption and decryption software on LPC microcontrollers (REV 1.1) ZIP (174.0 kB) AN11241 | 17 Mar 2014 |
Guidelines for full-speed USB on NXP®'s LPC microcontrollers (REV 1.1) PDF (148.0 kB) AN11392 | 20 Feb 2014 |
Interrupt handling during IAP calls for LPC177x_8x and LPC407x_8x (REV 1.0) ZIP (8.5 MB) AN11333 | 20 Jan 2014 |
Migrating from the LPC177x/8x to LPC407x/8x (REV 1.0) ZIP (3.3 MB) AN11335 | 01 Oct 2013 |
Memory to DAC data transfers using the LPC1700's DMA (REV 1.0) ZIP (470.0 kB) AN10917 | 09 Aug 2013 |
Using the LPC178x/7x power modes (REV 1.0) ZIP (826.0 kB) AN11096 | 09 Aug 2013 |
I2C secondary boot loader (REV 1.0) ZIP (661.0 kB) AN11258 | 09 Aug 2013 |
LPC1700 secondary USB bootloader (REV 3.0) ZIP (1.1 MB) AN10866 | 22 Jul 2013 |
SPI secondary boot loader (REV 1.0) ZIP (638.0 kB) AN11257 | 22 Jul 2013 |
How to implement the PMBus software stack (REV 1.0) ZIP (1.1 MB) AN11318 | 22 Jul 2013 |
BLDC motor control with LPC1700 (REV 2.0) ZIP (1.3 MB) AN10898 | 11 Jul 2013 |
Decoding DTMF tones using M3 DSP library FFT function (REV 1.0) PDF (505.0 kB) AN10943_ZH | 23 Aug 2012 |
UUencoding for UART ISP (REV 1.0) PDF (139.0 kB) AN11229 | 06 Jul 2012 |
PCB layout guidelines for NXP® MCUs in BGA packages (REV 2.0) PDF (272.0 kB) AN10778 | 22 Apr 2011 |
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UM10470;LPC177x/178x用户手册(简体中文) (REV 1.5) PDF (20.7 MB) LPC177X_178X_UM_SIMPCHN_1 | 16 Sep 2016 |
LPC178x/7x User manual (REV 3.1) PDF (6.7 MB) UM10470 | 17 Sep 2014 |
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MCUs with external memory bus, Ethernet, USB, and optional LCD (REV 1.0) PDF (707.0 kB) LPC177XLPC178X | 01 Jul 2011 |
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thin fine-pitch ball grid array package; 180 balls (REV 1.0) PDF (536.0 kB) SOT570-3 | 08 Feb 2016 |
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ADC design guidelines (REV 1.0) PDF (145.0 kB) TN00009 | 09 May 2014 |
Product | Status | Core | Clock speed [max] (MHz) | DMIPS | Flash (kB) | RAM (kB) | EEPROM (kB) | Security | GPIO | Ethernet | USB | USB (speed) | USB (type) | LCD | CAN | UART | I²C | SPI | I²S | ADC channels | ADC (bits) | Comparators | ADC sample rate | DAC (bits) | Timers | Timer (bits) | SCTimer / PWM | RTC | PWM | QEI | Package name | Temperature range | Temperature sensor | Supply voltage [min] (V) | IOH | Supply voltage [max] (V) | Demoboard | Product category |
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LPC1778FET180 | Active | Cortex-M3 | 120 | 150 | 512 | 96 | 4 | 141 | 1 | 1 | FS | host/device | 2 | 5 | 3 | 1 | 8 | 12 | 400 ksps | 10 | 4 | 32 | 1 | 1 | 6 | 1 | TFBGA180 | -40 °C to +85 °C | 2.4 | N | 3.6 | OM13001; OM13020 | 130-LPC1700- |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
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LPC1778FET180 | SOT570-3 | Tray, Bakeable, Single in Drypack | Active | LPC1778FET180,551 (9352 915 92551) | Standard Marking | LPC1778FET180 | Always Pb-free | NA | 3 |