The LPC2364HBD100 is a ARM7 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 72 MHz. Features include up to 128 kB of flash memory, up to 34 kB of RAM, Ethernet MAC, USB Device/Host/OTG, DMA controller, 4 UARTs, 2 CAN channels, 3 SSP/SPI, 3 I2C, I2S, 8-channel 10-bit ADC, 10-bit DAC, 2 PWM, 4 general purpose timers, low power Real-Time Clock with separate battery supply, and up to 70 general purpose I/O pins. The LPC23xx are pin-compatible to the LPC176x Cortex-M3 series.
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Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC (REV 7.1) PDF (400.0 kB) LPC2364_65_66_67_68 | 16 Oct 2013 |
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ES_LPC2364_66_68 (REV 9.1) PDF (160.0 kB) ES_LPC2364_66_68 | 23 Jul 2012 |
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Guidelines for full-speed USB on NXP®'s LPC microcontrollers (REV 1.1) PDF (148.0 kB) AN11392 | 20 Feb 2014 |
IEC 60601-1-8 audible alert generator using the LPC2000 (REV 1.1) ZIP (7.3 MB) AN10687 | 09 Aug 2013 |
UUencoding for UART ISP (REV 1.0) PDF (139.0 kB) AN11229 | 06 Jul 2012 |
PCB layout guidelines for NXP® MCUs in BGA packages (REV 2.0) PDF (272.0 kB) AN10778 | 22 Apr 2011 |
Migrating to the LPC1700 series (REV 1.0) PDF (615.0 kB) AN10878 | 06 Oct 2009 |
NicheLite for LPC implementation notes (REV 1.0) PDF (190.0 kB) AN10775 | 16 Jul 2009 |
Full-duplex software UART for LPC2000 (REV 1.0) PDF (1.1 MB) AN10689 | 18 Jan 2008 |
uC/OS-II Time Management in LPC2000 (REV 1.0) PDF (164.0 kB) AN10413 | 18 Jul 2007 |
Migrating to the LPC2300/2400 family (REV 1.0) PDF (191.0 kB) AN10576 | 05 Feb 2007 |
Using IAP for LPC2000 ARM devices (REV 1.0) PDF (123.0 kB) AN10256 | 25 Oct 2004 |
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LPC23XX User manual (REV 4.1) PDF (3.2 MB) UM10211 | 11 Sep 2012 |
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Cortex-M3 based microcontrollers with Ethernet, USB, CAN and 12-bit ADC; 100 MHz, 32-bit Microcontrollers with... (REV 1.0) PDF (123.0 kB) 75016676 | 01 Feb 2009 |
ARM7-based microcontrollers with Ethernet, USB, and CAN peripherals; 72-MHz, 32-bit microcontroller with... (REV 1.0) PDF (418.0 kB) 75016573 | 01 Aug 2008 |
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 | 01 Jun 2008 |
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plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm (REV 1.0) PDF (687.0 kB) SOT407-1 | 08 Feb 2016 |
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ADC design guidelines (REV 1.0) PDF (145.0 kB) TN00009 | 09 May 2014 |
Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE | 08 Oct 2009 |
PWM dual edge driver for 3-phase motor control using LPC23xx, LPC24xx (REV 1.0) ZIP (52.0 kB) TN0700X | 22 Jun 2007 |
Product | Status | Core | Clock speed [max] (MHz) | Flash (kB) | DMIPS | RAM (kB) | EEPROM (kB) | GPIO | Ethernet | USB | USB (speed) | USB (type) | LCD | CAN | UART | I²C | SPI | I²S | ADC channels | ADC (bits) | DAC (bits) | SCTimer / PWM | Timers | Timer (bits) | RTC | PWM | Package name | IOH | Temperature range | Supply voltage [min] (V) | Supply voltage [max] (V) | Product category | Demoboard |
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LPC2364HBD100 | Active | ARM7 | 72 | 128 | 34 | 70 | 1 | 1 | 2 | 4 | 3 | 1 | 1 | 8 | 10 | 10 | 1 | 4 | 32 | 2 | 12 | LQFP100 | N | -40 °C to +125 °C | 3 | 3.6 | 150-LPC2100/200/300/400- |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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LPC2364HBD100 | SOT407-1 | HTQFP-HLQFP-LQFP-MSQFP-WAVE | Tray, Bakeable, Single in Drypack | Active | LPC2364HBD100,551 (9352 887 99551) | Standard Marking | LPC2364HBD100 | Always Pb-free | 0.0 | 2.84 | 2.58E8 | 3 | 3 |