LPC3130FET180: Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller

The NXP® LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3130/3131 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.

LPC3130FET180: Product Block Diagram

sot570-3_3d

Data Sheets (1)

Name/Description	Modified Date
Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller (REV 2.0) PDF (506.0 kB) LPC3130_31	29 May 2012

Application Notes (5)

Name/Description	Modified Date
Using the LCD interface in the LPC313x/LPC314x/LPC315x devices (REV 1.0) PDF (618.0 kB) AN10880	06 Mar 2015
UUencoding for UART ISP (REV 1.0) PDF (139.0 kB) AN11229	06 Jul 2012
PCB layout guidelines for NXP® MCUs in BGA packages (REV 2.0) PDF (272.0 kB) AN10778	22 Apr 2011
LPC313x NAND flash data and bad block management (REV 1.0) PDF (110.0 kB) AN10860	11 Aug 2009
Programming SPI flash on EA3131 boards (REV 1.0) PDF (311.0 kB) AN10811	01 May 2009

Users Guides (1)

Name/Description	Modified Date
LPC3130/31 User manual (REV 2.0) PDF (2.6 MB) UM10314	26 Jun 2012

Brochures (1)

Name/Description	Modified Date
Industry’s Lowest Cost ARM9 with High Speed USB 2.0 OTG; NXP® ARM926EJ-S processor LPC313x (REV 1.0) PDF (588.0 kB) 75016629	01 Sep 2008

Package Information (1)

Name/Description	Modified Date
thin fine-pitch ball grid array package; 180 balls (REV 1.0) PDF (536.0 kB) SOT570-3	08 Feb 2016

Supporting Information (1)

Name/Description	Modified Date
ADC design guidelines (REV 1.0) PDF (145.0 kB) TN00009	09 May 2014

Software

LPC313x_SPI_Programmer_1 (REV 0.1) ZIP LPC313X_SPI_PROGRAMMER_1 4/30/2009

Ordering Information

Product	Status	Core	Clock speed [max] (MHz)	Flash (kB)	DMIPS	RAM (kB)	EEPROM (kB)	GPIO	Ethernet	USB	USB (speed)	USB (type)	LCD	CAN	UART	I²C	SPI	I²S	ADC channels	ADC (bits)	DAC (bits)	SCTimer / PWM	Timers	Timer (bits)	RTC	PWM	QEI	IOH	Package name	Temperature range	Supply voltage [min] (V)	Supply voltage [max] (V)	Product category	Demoboard
LPC3130FET180	Active	ARM9	180			96		97		1					1	2	1	2	4	10		1	4	32		1		N	TFBGA180	-40 °C to +85 °C	1.8	3.3	170-LPC3100/200-

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
LPC3130FET180		SOT570-3		Tray, Bakeable, Single in Drypack	Active	LPC3130FET180,551 (9352 880 13551)	Standard Marking	LPC3130FET180		Always Pb-free	0.0	2.84	2.58E8	NA	3