LPC3143FET180: ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD/MMC, NAND flash controller, Decryption Engine
The NXP® LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0 OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3143 have multiple power domains and a very flexible Clock
sot570-3_3d
Data Sheets (1)
Application Notes (2)
Users Guides (1)
Brochures (1)
Package Information (1)
Supporting Information (1)
Ordering Information
| Product | Status | Core | Clock speed [max] (MHz) | Flash (kB) | DMIPS | RAM (kB) | EEPROM (kB) | GPIO | Ethernet | USB | USB (speed) | USB (type) | LCD | CAN | UART | I²C | SPI | I²S | ADC channels | ADC (bits) | SCTimer / PWM | DAC (bits) | Timers | Timer (bits) | RTC | PWM | QEI | IOH | Package name | Temperature range | Supply voltage [min] (V) | Supply voltage [max] (V) | Product category | Demoboard |
|---|
| LPC3143FET180 | Active | ARM9 | 270 | | | 192 | | 97 | | | | | | | 1 | 2 | 1 | 2 | 4 | 10 | 1 | | 4 | 32 | | 1 | | N | TFBGA180 | -40 °C to +85 °C | 1.8 | 3.3 | 170-LPC3100/200- | OM11037 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|
| LPC3143FET180 | | SOT570-3 | | Tray, Bakeable, Single in Drypack | Active | LPC3143FET180,551
(9352 897 12551) | Standard Marking | LPC3143FET180 |    | Always Pb-free | NA | 3 |
