LPC43Sxx：Highest performance with DSP functionality, multi-core configurations, high-speed connectivity, advanced peripherals, and security options

Full range of high-speed connectiviy, timing and analog features combined with security features for code and data protection, including AES encryption, OTP key storage, and true random number generation.

特性和优势
    • Cores: 204 MHz, 32-bit ARM Cortex-M4F and 204 MHz, 32-bit ARM Cortex-M0 coprocessor
    • Memories and memory expansion
      • Up to 1 MB Flash - Up to 282 kB RAM
      • Memory expansion - SPI Flash interface (SPIFI)
      • 8/16/32-bit external memory controller (EMC)
    • Up to 1 MB Flash - Up to 282 kB RAM
    • Memory expansion - SPI Flash interface (SPIFI)
    • 8/16/32-bit external memory controller (EMC)
    • Advanced connectivity
      • Hi-Speed USB 2.0 interface, with on-chip Hi-Speed PHY, and Hi-Speed USB 2.0 with ULPI interface
      • Dual CAN 2.0
      • 10/100 Ethernet
      • Graphic LCD up to 1024 x 768 pixel resolution
    • Hi-Speed USB 2.0 interface, with on-chip Hi-Speed PHY, and Hi-Speed USB 2.0 with ULPI interface
    • Dual CAN 2.0
    • 10/100 Ethernet
    • Graphic LCD up to 1024 x 768 pixel resolution
    • Security features (LPC18Sxx devices only)
      • AES-128 encryption engine
      • True random number generator(TRNG)
      • OTP key storage
      • Code read protection (CRP)
    • AES-128 encryption engine
    • True random number generator(TRNG)
    • OTP key storage
    • Code read protection (CRP)
    • SCTimer/PWM
    • Configurable serial GPIO (SGPIO)
    • 8-channel GPDMA controller
    • Analog: Two 8-channel, 10-bit, 400 ksps ADCs; one 10-bit DAC
    • Basic serial connectivity
      • Two Fast-mode I²C
      • Three SPI
      • Four UARTs
    • Two Fast-mode I²C
    • Three SPI
    • Four UARTs
产品图片
演示板
OM13073
OM13073
关键参数
型号CoreClock speed [max] (MHz)DMIPSFlash (kB)RAM (kB)EEPROM (kB)SecurityGPIOEthernetUSBUSB (speed)USB (type)LCDCANUARTI²CSPII²SADC channelsADC (bits)DAC (bits)TimersTimer (bits)SCTimer / PWMRTCPWMQEIPackage nameTemperature rangeSupply voltage [min] (V)Supply voltage [max] (V)Product statusDemoboard
LPC43S20FBD144Cortex-M4F & M020443002000Y8301HShost/device024232810104321160LQFP144-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S20FET180Cortex-M4F & M020443002000Y11801HShost/device024232810104321160TFBGA180-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S30FBD144Cortex-M4F & M020443002640Y8312HS (2x)host/device024232810104321160LQFP144-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S30FET100Cortex-M4F & M020443002640Y4912HS (2x)host/device024232410104321160TFBGA100-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S30FET256Cortex-M4F & M020443002640Y16412HS (2x)host/device024232810104321161LBGA256-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S37JBD144Cortex-M4F & M0204430102413616Y8312HS (2x)host/device024132810104321160LQFP144-40 °C to +105 °C2.43.6ProductionOM13073
LPC43S37JET100Cortex-M4F & M0204430102413616Y4912HS (2x)host/device024232410104321160TFBGA100-40 °C to +105 °C2.43.6ProductionOM13073
LPC43S50FET180Cortex-M4F & M020443002640Y11812HS (2x)host/device124232810104321161TFBGA180-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S50FET256Cortex-M4F & M020443002640Y16412HS (2x)host/device124232810104321161LBGA256-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S57JBD208Cortex-M4F & M0204430102413616Y14212HS (2x)host/device124232810104321161LQFP208-40 °C to +105 °C2.43.6ProductionOM13073
LPC43S57JET256Cortex-M4F & M0204430102413616Y16412HS (2x)host/device124232810104321161LBGA256-40 °C to +105 °C2.43.6ProductionOM13073
LPC43S70FET100Cortex-M4F & M020443002820Y4912HS (2x)host/device024232312104321160TFBGA100-40 °C to +85 °C2.43.6ProductionOM13073
LPC43S70FET256Cortex-M4F & M020443002820Y16412HS (2x)host/device1242322210104321161LBGA256-40 °C to +85 °C2.43.6ProductionOM13073
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
LPC43S20FET180
TFBGA180
(SOT570-3)		sot570-3_posot570-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S20FET180E( 9353 059 12551 )
LPC43S30FBD144
LQFP144
(SOT486-1)		sot486-1_posot486-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC43S30FBD144E( 9353 045 33551 )
LPC43S30FET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S30FET100E( 9353 059 13551 )
LPC43S37JBD144
LQFP144
(SOT486-1)		sot486-1_posot486-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC43S37JBD144E( 9353 059 14551 )
LPC43S37JET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S37JET100E( 9353 044 09551 )
LPC43S50FET180
TFBGA180
(SOT570-3)		sot570-3_posot570-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S50FET180E( 9353 059 15551 )
LPC43S50FET256
LBGA256
(SOT740-2)		sot740-2_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S50FET256,551( 9352 962 79551 )
LPC43S57JBD208
LQFP208
(SOT459-1)		sot459-1_posot459-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC43S57JBD208E( 9353 059 16551 )
LPC43S70FET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S70FET100E( 9353 059 17551 )
LPC43S70FET256
LBGA256
(SOT740-2)		sot740-2_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC43S70FET256E( 9353 060 03551 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
LPC43S20FET180LPC43S20FET180EAlways Pb-freeNA3
LPC43S30FBD144LPC43S30FBD144EAlways Pb-freeNA3
LPC43S30FET100LPC43S30FET100EAlways Pb-freeNA3
LPC43S37JBD144LPC43S37JBD144EAlways Pb-free33
LPC43S37JET100LPC43S37JET100EAlways Pb-free33
LPC43S50FET180LPC43S50FET180EAlways Pb-freeNA3
LPC43S50FET256LPC43S50FET256,551Always Pb-freeNA3
LPC43S57JBD208LPC43S57JBD208EAlways Pb-free33
LPC43S70FET100LPC43S70FET100EAlways Pb-freeNA3
LPC43S70FET256LPC43S70FET256EAlways Pb-freeNA3
文档资料
档案名称标题类型格式日期
LPC43S50_30_20 (中文)32-bit ARM Cortex-M4/M0 flashless MCU with security features; up to 264 kB SRAM; Ethernet; two HS USBs; AESData sheetpdf2015-02-23
LPC43S70 (中文)32-bit ARM Cortex-M4 + 2 x M0 MCU; 282 kB SRAM; Ethernet; two HS USBs; 80 Msps 12-bit ADC; configurable peripherals, AES engineData sheetpdf2015-02-23
LPC43S5X_S3X (中文)32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, 2 x USB, LCD, EMC, AES engineData sheetpdf2015-02-23
75017636NXP 204 MHz dual-core Cortex-M4F and M0 32-bit MCUs LPC43Sxx: Microcontrollers with integrated security for protecting connected applicationsLeafletpdf2015-02-24
sot486-1_poplastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mmOutline drawingpdf2009-10-08
sot486-1_frFootprint for reflow soldering SOT486-1Reflow solderingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
sot570-3_pothin fine-pitch ball grid array package; 180 ballsOutline drawingpdf2010-04-28
sot570-3_frFootprint for reflow soldering SOT570-3Reflow solderingpdf2009-10-08
sot926-1_poplastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mmOutline drawingpdf2005-12-21
sot740-2_poplastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mmOutline drawingpdf2005-08-03
sot459-1_poplastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mmOutline drawingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
sot459-1_frFootprint for reflow soldering SOT459-1Reflow solderingpdf2009-10-08
订购信息
型号订购码 (12NC)可订购的器件编号
LPC43S20FET1809353 059 12551LPC43S20FET180E
LPC43S30FBD1449353 045 33551LPC43S30FBD144E
LPC43S30FET1009353 059 13551LPC43S30FET100E
LPC43S37JBD1449353 059 14551LPC43S37JBD144E
LPC43S37JET1009353 044 09551LPC43S37JET100E
LPC43S50FET1809353 059 15551LPC43S50FET180E
LPC43S50FET2569352 962 79551LPC43S50FET256,551
LPC43S57JBD2089353 059 16551LPC43S57JBD208E
LPC43S70FET1009353 059 17551LPC43S70FET100E
LPC43S70FET2569353 060 03551LPC43S70FET256E
32-bit ARM Cortex-M4/M0 flashless MCU with security features; up to 264 kB SRAM, Ethernet; two HS USBs, AES engine, LCD,... LPC43S50FET256
32-bit ARM Cortex-M4 + 2 x M0 MCU; 282 kB SRAM; Ethernet; two HS USBs; 80 Msps 12-bit ADC; configurable peripherals,... LPC43S70FET256
32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, 2 x USB, LCD, EMC, AES engine LPC43S57JET256
NXP 204 MHz dual-core Cortex-M4F and M0 32-bit MCUs LPC43Sxx: Microcontrollers with integrated security for protecting connected LPC43SXX
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm LPC2929FBD144
Footprint for reflow soldering SOT486-1 LPC2929FBD144
thin fine-pitch ball grid array package; 180 balls LPC3143FET180
Footprint for reflow soldering SOT570-3 LPC3143FET180
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm LPC2368FET100
plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm LPC43S70FET256
plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm LPC2939FBD208
HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64
Footprint for reflow soldering SOT459-1 LPC2939FBD208
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