数据手册DataSheet 下载:MF0MOU2101DA8 MIFARE Ultralight C - Contactless ticket IC.pdf
NXP Semiconductors has developed the MIFARE Ultralight C - Contactless ticket IC MF0ICU2 to be used in a contactless smart ticket or smart card in combination with Proximity Coupling Devices (PCD). The communication layer (MIFARE RF Interface) complies to parts 2 and 3 of the ISO/IEC 14443 Type A standard. The MF0ICU2 is primarily designed for limited use applications such as public transportation, event ticketing and loyalty applications.
In the MIFARE system, the MF0ICU2 is connected to a coil with a few turns. The MF0ICU2 fits for the TFC.0 (Edmonson) and TFC.1 ticket formats as defined in EN 753-2.
TFC.1 ticket formats are supported by the MF0xxU20 chip featuring an on-chip resonance capacitor of 16 pF.
The smaller TFC.0 tickets are supported by the MFxxU21 chip holding an on-chip resonance capacitor of 50 pF.
When the ticket is positioned in the proximity of the coupling device (PCD) antenna, the high speed RF communication interface allows the transmission of the data with a baud rate of 106 kbit/s.
An intelligent anticollision function allows to operate more than one card in the field simultaneously. The anticollision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without interference from another card in the field.
The anticollision function is based on an IC individual serial number called Unique IDentification. The UID of the MF0ICU2 is 7 bytes long and supports cascade level 2 according to ISO/IEC 14443-3.
产品特点 |
订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
MF0MOU2101DA8 | PLLMC (SOT500-4) | sot500-4_po | Reel Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | MF0MOU2101DA8,118( 9352 982 58118 ) |
订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF(小时) | 潮湿敏感度等级 | MSL LF |
MF0MOU2101DA8 | MF0MOU2101DA8,118 | Always Pb-free | NA | NA |
文档标题 | 类型分类 | 格式 | 更新日期 |
MF0ICU2 (中文):MIFARE Ultralight C – Contactless ticket IC | Data sheet | 2014-06-30 | |
MIFARE_Ultralight_EV1_v21:MIFARE Ultralight EV1; NXP IC solution for next generation contactless limited-use applications | Leaflet | 2012-10-01 | |
sot500-4_po:plastic leadless module carrier package; 35 mm wide tape | Outline drawing | 2011-02-18 |