NX2301P: 20 V, 2 A P-channel Trench MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 2 A P-channel Trench MOSFET (REV 1.0) PDF (343.0 kB) NX2301P | 03 Nov 2010 |
Application Notes (11)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH | 08 Nov 2013 |
| Medium power small-signal MOSFETs in DC-to-DC conversion (REV 3.0) PDF (738.0 kB) AN11119 | 07 May 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 | 29 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 | 27 Jan 2011 |
Selector Guides (3)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 | 11 Sep 2014 |
| Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288 | 23 Aug 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| NX2301P NXP Product Quality (REV 1.2) PDF (74.0 kB) NX2301P_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| NX2301P NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX2301P_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- NX2301P Spice parameter (REV 1.0) lib NX2301P_8_18_2010 6/10/2011
Ordering Information
| Product | Status | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | ID [max] (A) | Tj [max] (°C) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | RDSon [typ] @ VGS = 4.5 V (mΩ) | QG(tot) [typ] (nC) | Ptot [max] (W) | RDSon [typ] @ VGS = 2.5 V (mΩ) | QG(tot) [typ] @ VGS = 10 V (nC) | Qr [typ] (nC) | VGSth [typ] (V) | ID [max] @ T = 100 °C (A) | Automotive qualified | Ciss [typ] (pF) | IDM [max] (A) | Coss [typ] (pF) | Date | Rth(j-mb) [max] (K/W) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NX2301P | Active | SOT23 | TO-236AB | P | 1 | -20 | 120 | 190 | -2 | 150 | 0.9 | 4.5 | 100 | 4.5 | 0.4 | 155 | -0.75 | -1.2 | Y | 380 | -6 | 135 | 2011-01-25 | 380 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NX2301P | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | NX2301P,215 (9340 646 24215) | MG% | NX2301P |    | Always Pb-free | 149.0 | 0.69 | 1.45E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | NX2301PVL (9340 646 24235) | MG% | NX2301P | | Always Pb-free | 149.0 | 0.69 | 1.45E9 | 1 | 1 |
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Medium power small-signal MOSFETs in DC-to-DC conversion BAT54J
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- NX2301P NXP Product Quality nx2301p
- NX2301P NXP® Product Reliability nx2301p
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- NX2301P Spice parameter NX2301P
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- PMBFJ309
