NX3008NBKS: 30 V, 350 mA dual N-channel Trench MOSFET

Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT363
Data Sheets (1)
Name/DescriptionModified Date
30 V, 350 mA dual N-channel Trench MOSFET (REV 1.0) PDF (891.0 kB) NX3008NBKS01 Aug 2011
Application Notes (10)
Name/DescriptionModified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN1159913 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN1027310 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN1126119 May 2014
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN1115804 Feb 2014
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH08 Nov 2013
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN1124329 Oct 2012
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN1111316 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN1087427 Jan 2011
Selector Guides (3)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 7501763117 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 7501759011 Sep 2014
Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 7501728823 Aug 2012
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_108 Feb 2016
Packing (2)
Name/DescriptionModified Date
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_12520 Nov 2012
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_11515 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
NX3008NBKS NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX3008NBKS_131 Jan 2015
NX3008NBKS NXP Product Quality (REV 1.2) PDF (74.0 kB) NX3008NBKS_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (4)
Name/DescriptionModified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN0000831 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT36303 Jun 2013
S-Parameters
Ordering Information
ProductStatusPackage versionPackage nameChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)RDSon [typ] @ VGS = 4.5 V (mΩ)RDSon [typ] @ VGS = 2.5 V (mΩ)QG(tot) [typ] @ VGS = 10 V (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedID [max] @ T = 100 °C (A)IDM [max] (A)Ciss [typ] (pF)Coss [typ] (pF)DateRth(j-mb) [max] (K/W)
NX3008NBKSActiveSOT363TSSOP6N230140021001500.350.080.520.52100014000.280.9Y0.231.4346.52011-07-1934
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
NX3008NBKSSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveNX3008NBKS,115 (9340 656 37115)LB%NX3008NBKSAlways Pb-free149.00.691.45E911
Reel 7" Q3/T4, ReverseActiveNX3008NBKSH (9340 656 37125)LB%NX3008NBKS149.00.691.45E9
30 V, 350 mA dual N-channel Trench MOSFET nx3008nbks
Using power MOSFETs in parallel BUK7M12-60E
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
NX3008NBKS NXP® Product Reliability nx3008nbks
NX3008NBKS NXP Product Quality nx3008nbks
Power MOSFET frequently asked questions and answers BUK7M12-60E
MAR_SOT363 Topmark BSS84AKS
NX3008NBKS.01_02_2012 Spice parameter NX3008NBKS
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
BFU520Y