NX3008PBKS: 30 V, 200 mA dual P-channel Trench MOSFET _ BDTIC a Leading Distributor in China

NX3008PBKS: 30 V, 200 mA dual P-channel Trench MOSFET

Dual P-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT363

Data Sheets (1)

Name/Description	Modified Date
30 V, 200 mA dual P-channel Trench MOSFET (REV 1.0) PDF (894.0 kB) NX3008PBKS	01 Aug 2011

Application Notes (10)

Name/Description	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599	13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273	10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261	19 May 2014
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158	04 Feb 2014
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH	08 Nov 2013
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243	29 Oct 2012
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874	27 Jan 2011

Selector Guides (3)

Name/Description	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631	17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590	11 Sep 2014
Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288	23 Aug 2012

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1	08 Feb 2016

Packing (1)

Name/Description	Modified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115	15 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
NX3008PBKS NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX3008PBKS_1	31 Jan 2015
NX3008PBKS NXP Product Quality (REV 1.2) PDF (74.0 kB) NX3008PBKS_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (4)

Name/Description	Modified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008	31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363	03 Jun 2013

S-Parameters

NX3008PBKS.30_01_2012 Spice parameter (REV 1.0) lib NX3008PBKS_30_01_2012 4/16/2012

Ordering Information

Product	Status	Package version	Package name	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	I_D [max] (A)	T_j [max] (°C)	Q_GD [typ] (nC)	QG(tot) [typ] @ VGS = 4.5 V (nC)	R_DSon [typ] @ V_GS = 4.5 V (mΩ)	Q_G(tot) [typ] (nC)	QG(tot) [typ] @ VGS = 10 V (nC)	P_tot [max] (W)	R_DSon [typ] @ V_GS = 2.5 V (mΩ)	Q_r [typ] (nC)	V_GSth [typ] (V)	Automotive qualified	I_D [max] @ T = 100 °C (A)	C_iss [typ] (pF)	I_DM [max] (A)	C_oss [typ] (pF)	Date	R_th(j-mb) [max] (K/W)
NX3008PBKS	Active	SOT363	TSSOP6	P	2	-30			4100	6500	-0.2	150	0.09	0.55	2800	0.55		0.28	5300		-0.9	Y	-0.125	31	-0.8	6.5	2011-07-19	31

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
NX3008PBKS		SOT363	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	NX3008PBKS,115 (9340 656 38115)	LC%	NX3008PBKS		Always Pb-free	149.0	0.69	1.45E9	1	1

30 V, 200 mA dual P-channel Trench MOSFET nx3008pbks

Using power MOSFETs in parallel BUK7M12-60E

Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

Understanding power MOSFET data sheet parameters BUK7M12-60E

Understanding power MOSFET data sheet parameters BUK7K6R8-40E

Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW

Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW

NX3008PBKS NXP® Product Reliability nx3008pbks

NX3008PBKS NXP Product Quality nx3008pbks

Power MOSFET frequently asked questions and answers BUK7M12-60E

MAR_SOT363 Topmark BSS84AKS

NX3008PBKS.30_01_2012 Spice parameter NX3008PBKS

plastic surface-mounted package; 6 leads BSS84AKS

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS

BFU520Y

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