PBHV8115X: 150 V, 1 A NPN high-voltage low VCEsat (BISS) transistor
NPN high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT89 (SC-62) medium power and flat lead Surface-Mounted Device (SMD) plastic package.
PNP complement: PBHV9115X.
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 150 V, 1 A NPN high-voltage low VCEsat (BISS) transistor (REV 1.0) PDF (244.0 kB) PBHV8115X [English] | 09 Dec 2013 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBHV8115X NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBHV8115X_1 [English] | 31 Jan 2015 |
| PBHV8115X NXP Product Quality (REV 1.2) PDF (74.0 kB) PBHV8115X_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
SPICE model
- PBHV8115X SPICE model (REV 1.4) prm PBHV8115X_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | VCEsat [max] (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | hFE [min] | fT [typ] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV8115X | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | NPN | 520 | 150 | 1 | 50 | 100 | 30 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV8115X | | SOT89 | Reel 7" Q1/T1 | Active | PBHV8115X,115 (9340 614 21115) | O | PBHV8115X |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBHV8115X NXP® Product Reliability PBHV8115X
- PBHV8115X NXP Product Quality PBHV8115X
- PBHV8115X SPICE model PBHV8115X
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- BFU590Q
