PBHV9515QA: 150 V, 500 mA PNP high-voltage low VCEsat (BISS) transistor
PNP high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
NPN complement: PBHV8515QA.
sot1215_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 150 V, 500 mA PNP high-voltage low VCEsat (BISS) transistor (REV 1.0) PDF (243.0 kB) PBHV9515QA [English] | 19 Nov 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PBHV9515QA SPICE Model (REV 1.0) TXT PBHV9515QA_1 12/11/2015
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | VCEsat [max] (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | hFE [min] | fT [typ] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9515QA | Active | SOT1215 | DFN1010D-3 | 1.1 x 1.0 x 0.37 | PNP | 0.3250.54 | -150 | -0.5 | -300 | 100 | 75 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9515QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | PBHV9515QAZ (9340 690 65147) | 00 01 11 | PBHV9515QA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | PBHV9515QAX (9340 690 65115) | 00 01 11 | PBHV9515QA | 153.0 | 0.71 | 1.41E9 |
- PBHV9515QA SPICE Model PBHV9515QA
- DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
