PBRN113ZT: NPN 800 mA, 40 V BISS RETs; R1 = 1 kOhm, R2 = 10 kOhm
800 mA NPN low VCEsat Breakthrough In Small Signal (BISS) Resistor-Equipped Transistors (RET) family in small plastic packages.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| NPN 800 mA, 40 V BISS RETs; R1 = 1 kOhm, R2 = 10 kOhm (REV 1.0) PDF (155.0 kB) PBRN113Z_SER | 26 Feb 2007 |
Brochures (2)
| Name/Description | Modified Date |
|---|---|
| Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 | 01 Jun 2008 |
| 500 mA RETs for Automotive applications; NXP® 500 mA resistor-equipped transistors (RETs) PDTD and PDTB... (REV 1.0) PDF (1.1 MB) 75016559 | 01 Jun 2008 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBRN113ZT NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBRN113ZT | 31 Jan 2015 |
| PBRN113ZT NXP Product Quality (REV 1.2) PDF (74.0 kB) PBRN113ZT_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- PBRN113ZT SPICE model (REV 1.4) prm PBRN113ZT_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
|---|---|---|---|---|---|---|---|---|---|---|
| PBRN113ZT | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | NPN | 250 | 10 | 800 | 1 | 40 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBRN113ZT | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PBRN113ZT,215 (9340 589 87215) | %7L | PBRN113ZT |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
- 500 mA RETs for Automotive applications; NXP® 500 mA resistor-equipped transistors (RETs) PDTD and PDTB... PIMN31
- Letter Symbols - Transistors; General PEMD16
- PBRN113ZT NXP Product Quality PBRN113ZT
- PBRN113ZT NXP® Product Reliability PBRN113ZT
- plastic surface-mounted package; 3 leads PMBFJ309
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Footprint for reflow soldering SOT023 PMBFJ309
- Footprint for wave soldering SOT023 PMBFJ309
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- PBRN113ZT SPICE model PBRN113ZT
