PBSS302ND: 40 V, 4 A NPN low VCEsat (BISS) transistor _ BDTIC a Leading Distributor in China

PBSS302ND: 40 V, 4 A NPN low VCEsat (BISS) transistor

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.

PNP complement: PBSS302PD.

PBSS302ND: Product Block Diagram

PBSS302ND: Block Diagram

SOT457

Data Sheets (1)

Name/Description	Modified Date
40 V, 4 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (136.0 kB) PBSS302ND	18 Feb 2008

Application Notes (2)

Name/Description	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076	12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405	06 Jan 2006

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457	08 Feb 2016

Packing (2)

Name/Description	Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115	30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125	30 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBSS302ND NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302ND_1	31 Jan 2015
PBSS302ND NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302ND_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (3)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457	03 Jun 2013

SPICE model

PBSS302ND SPICE model (REV 1.4) prm PBSS302ND_1_2 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Transistor polarity	transistor polarity	P_tot [max] (mW)	number of transistors	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS302ND	Active	SOT457	TSOP6	2.9 x 1.5 x 1		NPN	360	1	40	4	15	300	500	150	55	450	75

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBSS302ND		SOT457	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	PBSS302NDH (9340 591 29125)	C7	PBSS302ND		Always Pb-free	153.0	0.71	1.41E9	1	1
PBSS302ND		SOT457		Reel 7" Q1/T1	Active	PBSS302ND,115 (9340 591 29115)	C7	PBSS302ND		Always Pb-free	153.0	0.71	1.41E9	1	1

40 V, 4 A NPN low VCEsat (BISS) transistor PBSS302ND

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

PBSS302ND NXP® Product Reliability PBSS302ND

PBSS302ND NXP Product Quality PBSS302ND

MAR_SOT457 Topmark 74LVC2G17_Q100

PBSS302ND SPICE model PBSS302ND

plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud

PESDXS5UD_SERIES

PBSS8110Y

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